Headset electronics

ABSTRACT

A wireless headset device that includes an earbud assembly and a primary housing assembly, fixed to the earbud assembly, is provided. The earbud assembly can include an earbud flexible circuit board having mounted thereon a receiver and processing circuitry. The primary housing assembly can include a microphone and a primary housing flexible circuit board electrically coupled to the earbud circuit board and the microphone. In some embodiments, the headset device can include at least one flexible circuit board and the primary housing can include a connector assembly. The at least one flexible circuit board can be electrically coupled to the connector assembly and can include Universal Serial Bus (USB) circuitry operative to process USB protocol communications and serial circuitry operative to process serial protocol communications.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of certain copending, commonlyassigned U.S. Provisional Patent Applications, namely, Ser. No.60/879,177 filed on Jan. 6, 2007; and Ser. No. 60/879,195 filed on Jan.6, 2007; all of which are incorporated herein by reference.

Commonly assigned DiFonzo et al. U.S. patent application Ser. No.11/235,873, filed Sep. 26, 2005, entitled “Electromagnetic Connector forElectronic Device” is hereby incorporated by reference in its entirety.

Commonly assigned Rohrbach et al. U.S. patent application Ser. No.11/235,875, filed Sep. 26, 2005, entitled “Magnetic Connector forElectronic Device” is hereby incorporated by reference in its entirety.

Commonly assigned Andre et al. U.S. patent application Ser. No.11/456,833, filed Jul. 11, 2006, entitled “Invisible, Light-TransmissiveDisplay System” is hereby incorporated by reference in its entirety.

Commonly assigned Andre et al. U.S. patent application Ser. No.11/551,988, filed Oct. 23, 2006, entitled “Invisible, Light-TransmissiveDisplay System” is hereby incorporated by reference in its entirety.

Commonly assigned Sanford et al. U.S. patent application Ser. No.11/651,094, filed Jan. 6, 2007, entitled “Antenna and Button Assemblyfor Wireless Devices” is hereby incorporated by reference in itsentirety.

Commonly assigned Terlizzi et al. U.S. patent application Ser. No.11/650,130, filed Jan. 5, 2007, entitled “Systems and Methods forDetermining the Configuration of Electronic Connections” is herebyincorporated by reference in its entirety.

Commonly assigned Rabu et al. U.S. patent application Ser. No.11/620,669, filed Jan. 6, 2007, entitled “Apparatuses and Methods thatFacilitate the Transfer of Power and Information Among ElectricalDevices” is hereby incorporated by reference in its entirety.

Commonly assigned Terlizzi et al. U.S. Provisional Patent ApplicationNo. 60/878,852, filed Jan. 5, 2007, entitled “Systems and Methods forMulti-State Switch Networks” is hereby incorporated by reference in itsentirety.

Commonly assigned Forstall U.S. Provisional Patent Application No.60/936,965, filed Jun. 22, 2007, entitled “Single User Input Mechanismfor Controlling Electronic Device Operations” is hereby incorporated byreference in its entirety.

FIELD OF INVENTION

The present invention can relate to headsets. More particularly, thepresent invention can relate to headsets for communicating with anelectronic device.

BACKGROUND OF THE INVENTION

Headsets for providing hands-free communications are known in the art.Such headsets typically can be used in conjunction with a cellulartelephone or a computer (e.g., Voice over IP). Some existing headsetsinclude a microphone, a speaker (also referred to as a receiver),electronics for controlling the headset and communicating with anotherdevice (e.g., a cellular telephone), a battery and a connector forre-charging the battery.

There are many aspects involved in the design of headsets. For example,the size and weight of headsets can be key issues because of how theytypically mount to a user's ear. A heavy or large headset can pull on auser's ear, creating an uncomfortable fit. The shape of headsetearpieces (e.g., earbuds) may also be an important design considerationto take into account as it is desirable for earpieces to fit comfortablyin, on, or over a wide range of different sizes and shapes of ears.

Additionally, the acoustic performance of headsets, such as receiversound generation quality and microphone sound reception quality (e.g.,ability to pick up a user's voice without undue background noise), canbe important design considerations. Achieving desired receiver andmicrophone acoustic performance can become increasingly difficult as thesize of a headset decreases.

Another example of an important design consideration can be the userinterface of a headset. It may be desirable for a user interface to beintuitive for a first-time user, yet convenient for an experienced user.

Aesthetics may be yet another important design consideration forheadsets.

Further still, ease of manufacturing headsets can be another designconsideration. For example, it can be desirable to design a headset thatcan be mass produced in an affordable fashion.

In view of the foregoing, there is a need for an improved headset thataddresses one or more of the above-identified considerations.

SUMMARY OF THE INVENTION

In accordance with one embodiment of the present invention, a wirelessheadset device that includes an earbud assembly and a primary housingassembly, fixed to the earbud assembly, is provided. The earbud assemblycan include an earbud flexible circuit board having mounted thereon areceiver and processing circuitry. The primary housing assembly caninclude a microphone and a primary housing flexible circuit boardelectrically coupled to the earbud circuit board and the microphone.

In accordance with another embodiment of the present invention, awireless headset device that includes an earbud assembly and a primaryhousing assembly, fixed to the earbud assembly, is provided. The earbudassembly can include an earbud flexible circuit board. The primaryhousing assembly can include a battery retaining region and a primaryhousing flexible circuit board. The circuit board components andcircuitry can be selectively mounted on the earbud flexible circuitboard and the primary housing flexible circuit board to maximize a sizeof the battery retaining region.

In accordance with yet another embodiment of the present invention, awireless device that includes an earbud assembly and a primary housingassembly, fixed to the earbud assembly, is provided. The primary housingassembly can have predetermined dimensions. The earbud assembly and theprimary housing assembly can each have mounted therein a flexiblecircuit board comprising circuitry.

In accordance with yet another embodiment of the present invention, aheadset device that includes an earbud assembly, a primary housingassembly, and at least one flexible circuit board is provided. Theprimary housing assembly can be fixed to the earbud assembly and caninclude a connector assembly. The at least one flexible circuit boardcan be electrically coupled to the connector assembly and can includeUniversal Serial Bus (USB) circuitry operative to process USB protocolcommunications and serial circuitry operative to process serial protocolcommunications.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be apparent upon consideration of thefollowing detailed description, taken in conjunction with accompanyingdrawings, in which:

FIG. 1 is a simplified block diagram of a headset in accordance with anembodiment of the present invention;

FIG. 2 is a simplified block diagram of a headset connector system inaccordance with an embodiment of the present invention;

FIG. 3 is a simplified cross-sectional illustration of a connectorassembly in accordance with an embodiment of the present invention;

FIG. 4 is a simplified cross-sectional illustration of another connectorassembly in accordance with an embodiment of the present invention;

FIG. 5 is a simplified block diagram of a headset in accordance with anembodiment of the present invention;

FIG. 6A is a simplified cross-sectional illustration of a portion of aheadset in accordance with an embodiment of the present invention;

FIG. 6B is a simplified cross-sectional illustration of a screw inaccordance with an embodiment of the present invention;

FIG. 7 is a simplified block diagram of a display system in accordancewith an embodiment of the present invention;

FIG. 8 is a simplified block diagram of a power distribution system inaccordance with an embodiment of the present invention;

FIG. 9 is a simplified block diagram of another power distributionsystem in accordance with an embodiment of the present invention;

FIGS. 10A and 10B are illustrations of a headset in accordance with anembodiment of the present invention;

FIG. 11 is an exploded view of a headset in accordance with anembodiment of the present invention;

FIG. 12 is an exploded view of a headset in accordance with anotherembodiment of the present invention;

FIG. 13 is a simplified diagram showing how software in a Bluetoothdevice is organized in accordance with an embodiment of the presentinvention;

FIG. 14 is a simplified block diagram of the electrical system of aheadset in accordance with an embodiment of the present invention;

FIG. 15 is a simplified block diagram of the core processor of a headsetin accordance with an embodiment of the present invention;

FIG. 16 is a simplified schematic diagram of a power distribution systemin accordance with an embodiment of the present invention;

FIGS. 17A-17C are illustrations of a traditional circuit board anddistribution of electrical components in a headset;

FIGS. 19A and 19B are illustrations comparing the traditional circuitboard of FIGS. 7A-7C to a circuit board with an improved distribution ofelectrical components in a headset in accordance with an embodiment ofthe present invention;

FIGS. 19A and 19B are illustrations comparing the traditional circuitboard of FIGS. 7A-7C to a circuit board with an improved distribution ofelectrical components in a headset in accordance with an embodiment ofthe present invention;

FIGS. 20A-20C are illustrations of an improved distribution ofelectrical components in a headset in accordance with an embodiment ofthe present invention;

FIG. 21A is an illustration of a headset earbud in accordance with anembodiment of the present invention;

FIG. 21B is a simplified exploded view of a headset earbud in accordancewith an embodiment of the present invention;

FIGS. 22-25 and FIG. 26A are simplified illustrations of a headsetearbud in various states of assembly in accordance with some embodimentsof the present invention;

FIG. 26B is a simplified cross-sectional view of an audio receiver inaccordance with an embodiment of the present invention;

FIG. 27A is a simplified cross-sectional view of a partially assembledheadset earbud in accordance with an embodiment of the presentinvention;

FIG. 27B is a simplified cross-sectional view of a fully assembledheadset earbud in accordance with an embodiment of the presentinvention;

FIG. 28 is an exploded view of an attachment system in accordance withan embodiment of the present invention;

FIG. 29 is a flowchart of an illustrative process for assembling aportion of a headset in accordance with an embodiment of the presentinvention.

FIGS. 30A and 30B are illustrations of a tool that can be used to assistin assembly of a portion of a headset in accordance with an embodimentof the present invention;

FIG. 30C is an illustration of the tool of FIGS. 30A and 30B being usedin accordance with an embodiment of the present invention;

FIG. 31 is a cross-sectional view of a “finished” tube in accordancewith an embodiment of the present invention;

FIG. 32 is a cross-sectional view of an initially manufactured tube inaccordance with an embodiment of the present invention;

FIG. 33 is a perspective view of a cross section of the tube of FIG. 31in accordance with an embodiment of the present invention;

FIG. 34 is an illustrative die and stamper for modifying the initiallymanufactured tube of FIG. 32 in accordance with an embodiment of thepresent invention;

FIG. 35 is a cross-sectional view of the tube of FIG. 34 once thestamper and die are removed from the tube in accordance with anembodiment of the present invention;

FIG. 36 is a perspective view of the tube of FIG. 35 once the tube ismachined to create an internal wall in accordance with an embodiment ofthe present invention;

FIG. 37 is a cross-sectional view of an illustrative tube formed using asingle impact extrusion in accordance with an embodiment of the presentinvention;

FIG. 38 is a perspective view of the tube of FIG. 37 once the tube ismachined to create an internal wall in accordance with an embodiment ofthe present invention;

FIG. 39 is a cross-sectional view of an illustrative tube formed using adouble impact extrusion in accordance with an embodiment of the presentinvention;

FIG. 40 is a perspective view of the tube of FIG. 39 once the tube ismachined to create an internal wall in accordance with an embodiment ofthe present invention;

FIG. 41 is a cross-sectional view of an illustrative tube formed using aprogressive deep draw process in accordance with an embodiment of thepresent invention;

FIG. 42 is a perspective view of a cross section of the tube of FIG. 41in accordance with an embodiment of the present invention;

FIG. 43 is a perspective view of the tube of FIGS. 41 and 42 once thetube is machined to create an internal wall in accordance with anembodiment of the present invention;

FIG. 44 is a flow chart of an illustrative process for forming anextruded tube with a feature on the internal surface of the tube withusing a die and stamper in accordance with an embodiment of the presentinvention;

FIG. 45 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a single impactextrusion in accordance with an embodiment of the present invention;

FIG. 46 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a impactextrusion on both ends of the tube in accordance with an embodiment ofthe present invention;

FIG. 47 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a progressivedeep draw process in accordance with an embodiment of the presentinvention;

FIG. 48 is a cross-sectional view of a visual indicator system inaccordance with an embodiment of the present invention;

FIG. 49 is an illustration of a visual indicator system of a headset inaccordance with an embodiment of the present invention;

FIGS. 50A and 50B are illustrations of a headset in accordance with anembodiment of the present invention;

FIG. 51 is an illustration of a connector in accordance with anembodiment of the present invention;

FIG. 52 is an exploded view of a connector in accordance with anembodiment of the present invention;

FIG. 53 is an illustration of a microphone boot in accordance with anembodiment of the present invention;

FIG. 54 is a cross-sectional view of a connector in accordance with anembodiment of the present invention;

FIGS. 55A-55D are illustrations of a headset in accordance with anembodiment of the present invention;

FIG. 56 is a cross-sectional view of an electrical contact assemblycoupled to a circuit board in accordance with an embodiment of thepresent invention;

FIGS. 57A and 57B are illustrations of an electrical contact assembly inaccordance with an embodiment of the present invention;

FIGS. 58A-58C are illustrations of an electrical contact assembly inaccordance with an embodiment of the present invention;

FIGS. 59A and 59B are illustrations of electrical contacts in accordancewith an embodiment of the present invention;

FIGS. 60A and 60B are illustrations of a connector plate in accordancewith an embodiment of the present invention;

FIGS. 61A and 61B are illustrations of magnetic components of aconnector in accordance with an embodiment of the present invention;

FIGS. 62A and 62B are illustrations of a connector in accordance with anembodiment of the present invention;

FIGS. 63A and 63B are illustrations of a connector in accordance with anembodiment of the present invention;

FIG. 64 is an illustration of a headset coupling with a complementaryconnector in accordance with an embodiment of the present invention;

FIG. 65 is a simplified graph of magnetic and spring forces involved inthe coupling of a headset with a complementary connector in accordancewith an embodiment of the present invention;

FIG. 66 is an illustration of a docking device that can receive aheadset in accordance with an embodiment of the present invention;

FIG. 67A is an illustration of a connector in accordance with anembodiment of the present invention;

FIG. 67B is an illustration of a headset coupling with a complementaryconnector in accordance with an embodiment of the present invention; and

FIG. 68 is a chart listing exemplary modes and functions of acommunications system in accordance with an embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to headsets and methods for manufacturingthe same. Headsets are communication devices that are worn on a user'shead in order to allow hands free data and/or voice communication with ahost device such as a computer, phone handset, cellular phone, anautomobile and/or the like. Headsets can include one or more speakers(in proximity to one or both ears) for audio output and/or one or moremicrophones for audio input.

Headsets can come in a variety of form factors or shapes. In some cases,headsets can be embodied as an earpiece that serves as the primarysupport mechanism for wearing the headset. For example the headset maybe supported on the head by an earpiece worn over or in the ear.Alternatively, the headset may be supported by a frame or band that fitson or over the user's head. The headset may include a fixed or movableboom that places the microphone closer to the user's mouth (wraps aroundthe face). Alternatively, the headset may be boomless such that themicrophone is integrated with the earpiece thereby forming a morecompact device (e.g., smaller, lighter, more aesthetically pleasing,etc.).

According to one aspect of the invention, the headset can be embodied asa small compact unit including a primary housing and an earbud memberextending therefrom. The earbud member may be attached to or integrallyformed with the primary housing. Various components can be placed at thesurface of or within the confines of the earbud member and the primaryhousing. In fact, both of them can include one or more componentsdepending on the needs of the device. The components contained withineach of these can be widely varied. Examples of operational componentscan include speakers, microphones, antennas, connectors, buttons,displays, indicators, battery, and associated processors, controllersand circuitry. Generally, the earbud member includes at least a speakerwhile the primary housing includes at least a microphone (although thisis not a requirement). Depending on their size, each of these memberscan include additional components of the headset. In one embodiment, theprimary housing includes an antenna, user interface button, indicator ordisplay (e.g., LEDs), battery, microphone, and/or a connector along withany accompanying circuitry while a speaker, a processor, and itsaccompanying circuitry can be located in the earbud. The button can belocated on one end of the main housing. A user can interface with thisbutton to perform various functions (e.g., terminating calls).

The shape and size and orientation of the earbud member and primaryhousing can be widely varied. In one embodiment, the earbud member isconfigured for insertion into the ear such that it supports theremaining portions of the headset (e.g., primary housing) proximate theuser's head. In one embodiment, the primary housing can be configured asa longitudinal member (e.g., a tube). In one example, an earbud member,which contains a speaker, perpendicularly protrudes away from one end ofa longitudinally extending primary housing, which includes a microphoneat an opposite end of the longitudinally extending primary housing.Furthermore, the earbud member can expand outwardly and then inwardlyfrom a neck portion that couples to the primary housing in order to forma bud that fits into an ear.

The primary housing can include a tube that forms a housing and receivesinternal components through an open end. The tube can be manufacturedusing one of several processes in order to reduce costs and increasespeed and efficiency. In one embodiment, the tube can be manufactured toinclude features on the inner surface of the tube for supportingelectronic components of the headset. Processes for creating such a tubecan include applying a die and stamp to an extruded tube, single ordouble impact extrusion, or a progressive deep draw process.

The headset can include a hollow neck between the earbud and the primaryhousing in order to allow electrical wires to connect sets of discreteelectronics disposed within the earbud and primary housing. In oneembodiment, dual threaded inserts can be used to structurally reinforcethe hollow neck without adding size to the device.

Small compact headsets have limited surface area for placing components.Therefore, one aspect of the invention relates to integrating multiplecomponents into the same surface area of the headset in order to helpform a small compact headset. Put another way, multiple components canbe built into the same location on the headset in order to achieve thedesired level of functionality without impacting a desired small size ofthe headset. The components may for example be selected from connectors,microphones, speakers, buttons, indicators, displays and/or the like. Inone embodiment, an antenna and a button function at the same location ofthe headset. In another embodiment, a microphone and connector functionat the same location of the headset. Other embodiments can also berealized. For example, a button can function at the same location of aspeaker (e.g., at an earbud) or an indicator can function at the samelocation of a microphone.

Small compact headsets also have limited internal volume for placinginternal components. Therefore one aspect of the invention relates todividing/separating internal electronic assemblies into small multiplecomponents that can be positioned at different locations (discretely)within the headset. By way of example, the electronics that wouldnormally be embodied on a single large circuit board may bedivided/separated out and placed on multiple smaller circuit boards,each of which can be positioned at different locations within theheadset. The smaller circuit boards can be more easily placed withinvarious small internal pockets found in a small compact device. Flexiblewires and possibly wireless protocols can be used to operatively couplethe electronics and/or discrete circuit boards together. In other words,a first portion of the electronics may be separated from a secondportion of the electronics, and further the first portion may bepositioned at a first location within the headset while the secondportion may be positioned at a second location within the headset. Notethat, two portions is not a limitation and the electronics can bedivided into any number of smaller discrete portions.

Along a similar vein, another aspect of the invention relates toelectronic assemblies that are partially flexible or bendable such thatthe assemblies can be folded into a small compact form in order to fitinside tightly spaced internal volumes. By way of example, theelectronics that would normally be embodied on a single rigid circuitboard may be placed on multiple rigid circuit boards that areinterconnected by flexible or bendable circuit board portions that canbe bent around various internal shapes and/or folded over itself whilestill functioning properly.

Another aspect of the invention relates to acoustical paths, ports andvolumes that are built through a small compact headset in order toimprove acoustical performance of the microphone and/or speaker (withlimited impact on the form factor of the headset). In one embodiment, inorder to control the flow of air through an earbud, acoustic ports canbe integrated into one or more electronic components disposed thereinand/or the earbud housing. In another embodiment, at least some of theports that pass through the various housings are substantially hiddenfrom view thereby enhancing the aesthetic appearance of the headset. Forexample, the ports may be positioned within a seam between twointerfacing external surfaces of the headset. In one example, a firstexternal surface is provided by the open end of a tube of the primaryhousing and the second external surface is provided by an end memberdisposed within the open end of the tube of the primary housing. The endmember may for example include a connector assembly thereby integratinga connector with a microphone into the same surface area.

In accordance with one aspect of the invention, the connector assemblycan include contacts for the transfer of power and data. The connectorcan be located on the end of the primary housing opposite a userinterface button. The connector can have a symmetrical configuration sothat it can be coupled with complementary connectors in more than oneinterface orientation (e.g., 90 degree symmetry, 180 degree symmetry,etc.). In one embodiment, switching circuitry can be included in orderto accommodate this symmetry. Such circuitry can, for example, measurethe polarity of data and/or power lines from the complementary connectorto determine its interface orientation and route the data and/or powerlines based on the determined orientation. In some embodiments, theconnector assembly can be at least partially made of a ferromagneticmaterial, which can serve as an attraction plate for one or more magnetson a complementary connector in another device (e.g., a headsetcharger).

In accordance with another aspect of the invention, the headset caninclude an indicator that is hidden from view when inactive and that isin view when active. This can for example be accomplished withmicrometer sized holes, called microperforations, that can be drilledinto the wall of primary housing and/or earbud member. Through theseholes, light sources on the inside of the primary housing and/or earbudmember can create visual indicators for a user. A light diffuser can beused in combination with such microperforations so that the indicatorcan be illuminated with evenly distributed light.

Headsets may communicate with the host device via a wired and/orwireless connection. Wired connections may for example occur through acable/connector arrangement. Wireless connections on the other hand canoccur through the air (no physical connection is needed). The wired andwireless protocols may be widely varied. Wired protocols may for examplebe based on Universal Serial Bus (USB) interfaces, Firewire interfaces,conventional serial interfaces, parallel interfaces, and/or the like.Wireless protocols may, for example, be based on short rangetransmissions of voice and/or data. The wireless protocols may furtherbe used to create personal area networks between the headset and anearby host device such as a cellular phone. Some examples of wirelessprotocols that can be used include Bluetooth, Home RF, iEEE 802.11,IrDA, Wireless USB, and the like. The communication electronics may beembodied as a system on a chip (SOC).

Although other wireless protocols may be used, according to one aspectof the invention, the headset can include communication electronicsbased on the Bluetooth wireless protocol. The communication electronicsmay, for example, include or correspond to a Bluetooth System-on-a-Chip(SoC). The SoC can include circuitry for performing functions other thanwireless communications. For example, in some embodiments, circuitry forcommunicating using wired Universal Serial Bus (USB) interfaces andconventional serial interfaces can be integrated into the SoC.

For increased functionality, according to one aspect of the invention,the headset can include power distribution circuitry. Such circuitry canoperate the headset according to several different modes depending, forexample, on the charge level of the battery or the availability of anexternal power source. In one mode, the power distribution circuitry cansupply power to limited parts of the SoC while simultaneously chargingthe battery. The battery charging process can be further improved byusing temperature detection circuitry (e.g., a thermistor) to monitorthe battery temperature. This process can extend the battery life bycharging it only when the monitored temperature is at, or below, apredetermined threshold. In another mode, the power distributioncircuitry can selectively power various electronic components using thebattery while other electronic components may be powered by an externalpower source.

Aspects and embodiments of the invention are discussed below withreference to FIGS. 1-68. However, those skilled in the art will readilyappreciate that the detailed description given herein with respect tothese figures is for explanatory purposes as the invention extendsbeyond these limited embodiments.

FIG. 1 is a simplified block diagram of headset 10 in accordance withone embodiment of the present invention. Headset 10 can be configured tobe a small compact unit in the form of a simple earpiece that can beplaced in the ear. The headset can include a primary housing 11 and anearbud 12 that extends from the primary housing. Earbud 12 can fit intoan ear thereby placing the primary housing next to a user's face. Eachof these members can surround and protect various internal componentsand can also support thereon various external components associated withoperating the headset. The components may be a plurality of electricalcomponents that provide specific functions for the electronic device.For example, the components may generally be associated with generating,receiving, and/or transmitting data associated with operating thedevice.

Headset 10 includes processor 20 for controlling the headset'sfunctions. In the illustrated embodiment, processor 20 can be providedin earbud 12. In other embodiments, processor 20 can be located anywherein headset 10. Processor 20 can be electrically coupled to the othercomponents of headset 10 through circuit boards and/or cables. Processor20 may facilitate wireless communications with a host device. Forexample, processor 20 can generate signals for wireless transmission andprocess received wireless signals. In addition to wirelesscommunications, processor 20 may coordinate the operation of the variouscomponents of headset 10. For example, processor 20 may control thecharging of a battery or the operation of a display system.

Headset 10 also includes speaker system 13 for distributing audioinformation from earbud 12. Speaker system 13 can include an audio portat the end of the earbud and a receiver (e.g., a speaker) disposed atthe end of the audio port. The audio port may be covered with a grill.Speaker system 13 may also include various ports internal and externalto the earbud. For example, speaker system 13 may include acousticalpaths inside the earbud and acoustical paths that pass through thesurfaces of the earbud.

Headset 10 also includes one or more input mechanisms for providinginputs to the headset. The input mechanism may be placed at the primaryhousing and/or the earbud. The input mechanisms may be widely varied andmay include for example slide switches, depressible buttons, dials,wheels, navigation pads, touch pads, and/or the like. For simplicitypurposes, the headset may only include a single input mechanism.Furthermore, for aesthetical reasons, the input mechanism may be placedat a select location. In other embodiments, two or more input mechanismsmay reside on the headset.

In one embodiment, headset 10 includes single button 14 located at oneend of primary housing 11. Placing button 14 at the end preserves theside surfaces of primary housing 11. This can also be accomplished byconfiguring earbud 12 as a button (e.g., the earbud is depressiblerelative to the primary housing). Earbud 12 may also be configured totilt, rotate, bend and/or slide in order to provide inputs whilepreserving the side surfaces of primary housing 11.

Headset 10 also includes a communication terminal for communicating witha host device. The communication terminal may be configured for wired orwireless connections. In the illustrated embodiment, the communicationterminal is antenna 15 that supports wireless connections. Antenna 15may be located internal to the primary housing or earbud. If the primaryhousing or earbud is not formed from a radio transparent material then aradio transparent window may need to be provided. In the illustratedembodiment, antenna 15 is located at one end of the headset. Placingantenna 15 and the accompanying radiotransparent window at the endpreserves the side surfaces of primary housing 11. In one embodiment,button 14 and antenna 15 are integrated at the same end.

Headset 10 may also include one or more connectors 16 for transferringdata and/or power to and from the headset. A data connection allows datato be transmitted to and received from a host device. A powerconnection, on the other hand, allows power to be delivered to theheadset. The connectors may for example connect to a correspondingconnector in a dock or cable in order to connect to a power source forcharging and/or a data source for downloads or uploads. Although thelocation of the connector can be widely varied, in the illustratedembodiment, connector 16 is located at one of the ends in order topreserve the side surfaces of the primary housing.

In some embodiments, connector 16 and corresponding connectors may beshaped such that the two connectors can mate in two or more differentinterface orientations. To compensate for this possibility, headset 10can include switching circuitry that is coupled to connector 16. Suchswitching circuitry can determine how connector 16 is coupled with acorresponding connector (e.g., how the connectors are physicallyorientated). Switching circuitry can determine this by measuring, forexample, the polarity of data and/or power lines from the complementaryconnector. Switching circuitry can then route the data and/or power fromthe connector to other circuitry in headset 10 appropriately. In someembodiments, at least a portion of connector 16 can be magnetic ormagnetically attractive. For example, connector 16 may include aferromagnetic material that biases it to magnetic connectors. Suchmagnetic interactions can assist a user in coupling connector 16 withcorresponding connectors and help prevent the connectors fromuncoupling.

Headset 10 also includes microphone 17 for capturing speech provided bya user. The microphone is typically located internal to the primaryhousing. One or more acoustical ports may be configured into the primaryhousing in order to provide an acoustical path from outside the primaryhousing to the microphone. The location of the acoustical ports can bewidely varied. In one embodiment, the acoustical ports are located atone end of the primary housing in order to preserve the sides of theprimary housing. In one embodiment, the connector assembly andacoustical ports are integrated at the same end. Furthermore, theacoustical port may be configured to be substantially hidden from viewby selective placement of the ports. For example, the ports may beplaced at the seam between the connector assembly and the primaryhousing.

Headset 10 also includes display system 18 for providing visualfeedback. The display system may be a complex display system comprisingan LCD or other related display device capable of displaying graphicalinformation and/or it may be an indicator assembly that only providessimple visual feedback as for example via an LED assembly. In oneembodiment, the display system only comprises an indicator assembly thatprovides visual feedback along the side walls of the primary housing. Inorder to preserve the side walls, however, the indicator assembly may behidden when inactive. This can be accomplished, for example, throughmicroperforations through the primary housing. The microperforationsallow light to pass through, but are so small that they are undetectableto a user.

Headset 10 also includes battery 19. Battery 19 may provide electricalpower to components of headset 10. Charging circuitry may also beprovided to charge battery 19 when an external power supply is connectedto headset 10.

Headset 10 can also include support circuitry for the aforementionedcomponents. For example, this may include circuit boards, variouselectrical components, processors and controllers. The support circuitrycan be placed inside the primary housing and/or the earbud. In oneembodiment, the support circuitry can be split or divided between thetwo locations in order to make a more compact device, i.e., the variouselectronics are distributed among volumes as needed. In order to furthersave space, the electronics may be stackable. In one embodiment, theelectronics are placed on a circuit board with one or more flexibleportions so that a stack is created by folding or bending the circuitboard.

Although earbud 12 and primary housing 11 can be integrally formed, inthe illustrated embodiment, the primary housing and earbud are separatehousing members that are attached together. Any suitable means can beused to attach the two parts together including but not limited toscrews, glues, epoxies, clips, brackets, and/or the like.

The position of the earbud relative to the primary housing may be widelyvaried. For example, the earbud may be placed at any external surface(e.g., top, side, front, or back) of the primary housing. In oneembodiment, the earbud is located on a planar front side near one of theends of the primary housing. In one embodiment, the earbud may beconfigured to move relative to the primary housing so that its positioncan be adjusted.

Each of the earbud 12 and primary housing 11 can be configured tosurround its internal components at a peripheral region thereof so as tocover and protect the internal components. They can also be configuredto support components externally if needed. Each of earbud 12 andprimary housing 11 help define the shape and form of the headset. Thatis, their contours embody the outward physical appearance of theheadset. Such contours may be rectilinear, curvilinear or both. In oneembodiment, earbud 12 is formed as an outwardly extending protrudingmember while primary housing 11 is formed as a longitudinally extendingmember. For example, earbud 12 may be coupled to primary housing 11through a neck, which can be a portion of the primary housing, earbud ora separate piece altogether. The axis of earbud 12 and primary housing11 can be transverse, and more particularly perpendicular. The shapes ofearbud 12 and primary housing 11 may be widely varied. In oneembodiment, earbud 12 is formed as a reverse rounded circular conicalmember and primary housing 11 is configured with a pill shaped crosssection. It is understood however that these are not limitations andthat the form, shape, and orientation may vary according to the specificneeds or design of the headset. By way of example, earbud 12 and primaryhousing 11 may have various cross-sectional shapes including forexample, circular, square, rectangular, triangular, oval, and/or thelike. In addition, their form may be such that they do not have atypical straight axis.

Earbud 12 and primary housing 11 may be formed by one or more members.In one embodiment, primary housing 11 may include an integrally formedmember. By integral, it is meant that the member is a single completeunit. By being integrally formed, the member can be structurallystronger than conventional housings, which include two parts that arefastened together. Furthermore, unlike conventional housings that have aseam between the two parts, the member has a substantially seamlessappearance. Moreover, the seamless housing can prevent contamination andcan be more water resistant than conventional housings. The primaryhousing may, for example, be formed as a tube that defines a cavitytherethrough between a first open end and second open end locatedopposite the first open end. In order to seal the ends of the tube, theprimary housing can additionally include a pair of end caps. Each of theend caps can be configured to cover one of the open ends thereby forminga fully-enclosed housing system. The end caps may be formed from similaror different materials as the tube. Furthermore, the end caps may beattached to the tube using a variety of techniques, including but notlimited to, fasteners, glues, clips, brackets, and/or the like. The endcaps can also be movably attached, and be configured to carryoperational components of the headset.

It is understood that the inner cross-sectional shape of primary housing11 may be the same or different from the external cross-sectional shapeof the primary housing. For example, it may be desirable to have a pillshaped external and a rectangularly shaped interior, etc. In addition,although not a requirement, the front and back surface of primaryhousing 11 may be substantially planar.

In one embodiment, primary housing 11 can be formed via an extrusion orrelated process. The extrusion process is capable of producing anintegral tube without seams, crack, breaks, etc. As is generally wellknown, extrusion is a shaping process where a continuous work piece isproduced by forcing molten or hot material through a shaped orifice,i.e., the extrusion process produces a length of a particularcross-sectional shape. The cross-sectional shape of the work piece iscontrolled at least in part on the shaped orifice. As the shaped workpiece exits the orifice, it is cooled and thereafter cut to a desiredlength. The extrusion process is a continuous high volume process thatproduces intricate profiles and that accurately controls work piecedimensions (which can be a necessity for smaller parts). Furthermore,because extrusion has low tooling costs, it is relatively inexpensivewhen compared to other forming or manufacturing processes.

Primary housing 11 may be formed from a variety of extrudable materialsor material combinations including but not limited to metals, metalalloys, plastics, ceramics and/or the like. By way of example, themetals may correspond to aluminum, titanium, steel, copper, etc., theplastic materials may correspond to polycarbonate, ABS, nylon, etc, andthe ceramic materials may correspond to alumina, zirconia, etc. Zirconiamay, for example, correspond to zirconia oxide.

FIG. 2 shows headset connector system 200 in accordance with anembodiment of the present invention. System 200 can include headset 210and headset engaging connector 220. In some embodiments, headset 210 maycorrespond to headset 10 of FIG. 1. Headset 210 can include any numberof headset connector contact regions (see e.g., regions 211, 212 and213) disposed within face 214 of the headset. Face 214 can mate withheadset engaging connector 220 such that a corresponding number ofheadset engaging contact regions disposed in the headset engagingconnector (see e.g., regions 221, 222 and 223) electrically couple withthe headset connector contact regions. Moreover, headset 210 can includeswitching circuitry 215 that is electrically coupled with each of theheadset connector contact regions. Switching circuitry 215 can beoperative to determine an interface orientation between the headsetconnector contact regions and headset engaging contact regions. Forexample, switching circuitry 215 can determine the interface orientationin which headset 210 is mated with headset engaging connector 220.Switching circuitry 215 can determine this by measuring the polarity ofdata and/or power lines from headset engaging connector 220. Afterhaving determined the interface orientation, switching circuitry 215 canroute signals received on the headset connector contact regions based onthe determined orientation. It is understood that switching circuitrycan be provided in connector 220 to provide functionality similar toswitching circuitry 215. For example, switching circuitry in connector220 can determine the interface orientation of headset 210 and routeelectrical signals to contact regions based on the determinedorientation.

In some embodiments, at least a portion of headset 210 and/or headsetengaging connector 220 (e.g., a portion or all of housing 224) can bemagnetically attractive. Moreover, headset engaging contact regions (seee.g., regions 221, 222, and 223) may be biased to protrude from housing224 of connector 220. In such embodiments, headset 210 can bemagnetically attracted to headset engaging connector 220 such that themagnetic forces can cause the headset engaging contact regions (seee.g., regions 221, 222, and 223) to press against the headset connectorcontact regions (see e.g., regions 211, 212, and 213).

FIG. 3 shows electronic device 300 in accordance with an embodiment ofthe present invention. In some embodiments, device 300 may be anelectronic headset (see e.g., headset 10 of FIG. 1), but it is to beunderstood that device 300 is not limited to electronic headsets. Device300 can include housing 310 and connector assembly 320. At least aportion of connector assembly 320 may be disposed in housing 310.Connector assembly 320 may include port 322, microphone 324 and channel326 that fluidically couples the microphone to the port. Connectorassembly 320 may also include one or more contacts (see e.g., contacts321, 323, 325 and 327) for electrically coupling with another device.Port 322 may be provided in a location such that the contacts ofconnector assembly 320 are on the same exterior surface as the port orlocated nearby. In some embodiments, port 322 may be located between twocontacts (see e.g., contacts 323 and 325).

FIG. 4 shows electronic device 400 in accordance with another embodimentof the present invention. Like device 300, device 400 may be anelectronic headset in some embodiments (see e.g., headset 10 of FIG. 1)but it is to be understood that device 400 is not limited to electronicheadsets. Device 400 can include housing 410 and joint connector andmicrophone assembly 420. Microphone 430, boot 440 and connector plate450 may be provided in joint connector and microphone assembly 420.Microphone 430 may include one or more side surfaces and a top surfacewith microphone port 432. Microphone boot 440 may be mounted to themicrophone such that the boot forms a seal with at least a portion ofthe top surface and the side surfaces. This seal can surround microphoneport 432. Microphone boot 440 can further include a portion for sealingto connector plate 450 and an aperture for fluidically connectingmicrophone port 432 to connector port 452. Connector plate 450 mayinclude one or more contacts (see e.g., contacts 451, 453, 455 and 457)for electrically coupling with another device. Connector port 452 may beprovided in a location such that the port is in the same exteriorsurface as the contacts of connector assembly 420 or located near thecontacts. In some embodiments, port 452 may be located between twocontacts (see e.g., contacts 453 and 455).

FIG. 5 shows headset 500 in accordance with an embodiment of theinvention. Headset 500 may correspond to an electronic headset (seee.g., headset 10 of FIG. 1) and may include primary housing 510 andearbud 520. Primary housing 510 may correspond to primary housing 11 andearbud 520 may correspond to earbud 12, for example. Earbud flexiblecircuit board 522 may be provided in earbud 520. Receiver 524 andprocessing circuitry 526 can be mounted on the earbud flexible circuitboard 522. Earbud flexible circuit board 522 may be flexible such thatit can fold upon itself or bend. Such flexibility may allow earbudflexible circuit board 522 to fit in smaller or lesstraditionally-shaped earbuds.

Primary housing 510 may be fixed to earbud 520. Primary housing 510 mayinclude primary housing flexible circuit board 512 and microphone 514.Like earbud flexible circuit board 522, primary housing flexible circuitboard 512 may be flexible such that it can fold upon itself or bend.Such flexibility may allow primary housing circuit board 512 to bendaround other components in the primary housing (e.g., circuitry,antennas, or batteries) so as to conserve interior space inside theprimary housing. For example, conserving interior space may result inmore room to accommodate a larger battery. In another example,conserving interior space may result in a smaller primary housing.Earbud flexible circuit board 522 and microphone 514 can be electricallycoupled to primary housing flexible circuit board 512. In someembodiments, such as the one shown in FIG. 5, earbud flexible circuitboard 522 may extend into primary housing 510 such that it can couplewith primary housing flexible circuit board 512. In other embodiments,primary housing flexible circuit board 512 may extend into earbud 520such that it can couple with earbud flexible circuit board 522. It is tobe understood that although primary housing flexible circuit board 512and earbud flexible circuit board 522 are described as being flexible,one or both circuit boards may include both flexible and rigid portions.For example, each circuit board may include one or more rigid portionsupon which electrical components (e.g., receiver 524, processingcircuitry 526, or microphone 514) can be easily and stably mounted.

FIG. 6A shows headset device 600 in accordance with an embodiment of thepresent invention. Headset device 600 can include earbud housing 610,threaded neck 620, and primary housing 630. Headset device 600 cancorrespond to headset 10 of FIG. 1 such that, for example, earbudhousing 610 corresponds to earbud 12 and primary housing 630 correspondsto primary housing 11. Earbud housing 610 can include earbudthrough-hole 612 and neck engaging surface 614. Threaded neck 620 caninclude first neck surface 622 that can mate with the earbud housing'sneck engaging surface 614. First neck surface 622 and neck engagingsurface 614 may include one or more features (e.g., protrusions, tabs,slots or notches) such that they can only be coupled in a certainorientation (with respect to each other).

Primary housing 630 can include primary housing through-hole 632 andneck engaging surface 634. Threaded neck 620 can further include secondneck surface 624 that can mate with the primary housing's neck engagingsurface. Second neck surface 624 and neck engaging surface 634 mayinclude one or more features (e.g., protrusions, tabs, slots or notches)such that they can only be coupled in a certain orientation (withrespect to each other).

FIG. 6B shows screw 690 for use with headset device 600 in accordancewith the present invention. Screw 690 can be used as both an earbudscrew and a primary housing screw. Screw 690 can include hollow channel692 running through the center of the screw. Screw 690 may also includefeatures 694 (e.g., notches) such that a tool can interface with thefeatures and rotate the screw. As an earbud screw, screw 690 can beinserted into earbud through-hole 612 and tightened such that it fastensneck engaging surface 614 to first neck surface 622. As a primaryhousing screw, screw 690 can be inserted into primary housingthrough-hole 632 and tightened such that it fastens neck engagingsurface 634 to second neck surface 624.

FIG. 7 shows display system 700 in accordance with an embodiment of thepresent invention. Display system 700 can, for example, correspond todisplay system 18 of FIG. 1. System 700 can include housing 710, lightsource 720, diffuser 730 and control circuitry 740. Housing 710 can havesignal indicator region 712 disposed therein. Signal indicator region712 may be, for example, one or more apertures (e.g., microperforations)for transmitting light. Signal indicator region 712 may be configured tooutput a signal of a certain shape or form. Housing 710 can also includeinternal wall 714. Diffuser 730 can be located between light source 720and internal wall 714. Control circuitry 740 may be electrically coupledwith light source 720 to control when light source 720 emits light.

Diffuser 730 may be operable to diffuse light from light source 720 suchthat all of the light exiting the diffuser has an equal intensity orbrightness. For example, diffuser 730 may be operable to evenlyilluminate signal indicator region 712 with the light from light source720. Diffuser 730 may be composed of a mixture of different particlesthat cause light diffusion. For example, diffuser 730 can include mainlyclear particles with translucent particles distributed throughout. Thetranslucent particles can cause light to be deflected from its originalcourse so that the light is distributed throughout the diffuser.Accordingly, light exiting from any portion of the diffuser will havesubstantially even illumination.

FIG. 8 shows power distribution system 800 in accordance with anembodiment of the present invention. Power distribution system 800 canbe employed in an electronic device (see e.g., headset 10 of FIG. 1) andcan include switch 810, bus 820, first power regulating circuitry 822,core processing circuitry 824, battery 830, second power regulatingcircuitry 832, RF processing circuitry 834, and control circuitry 840.Core processing circuitry 824 may include circuitry for handlinglow-level, core functions of the electronic device, and RF processingcircuitry 834 may include circuitry for handling RF communications forthe electronic device. To power core processing circuitry 824 and RFprocessing circuitry 834, power distribution system 800 can include bothbus 820 and battery 830 as potential power sources.

Bus 820 can be coupled to receive power from a source external to thesystem. For example, bus 820 may be coupled to a connector such that thebus can receive power through the connector. First power regulatingcircuitry 822 may be electrically coupled to bus 820 and core processingcircuitry 824. First power regulating circuitry 822 may be operable to,for example, convert power from bus 820 into a condition suitable forcore processing circuitry 824 (e.g., by changing the voltage orregulating the current flow).

Battery 830 can be a device that stores chemical energy and makes itavailable in an electrical form. Battery 830 may be rechargeable. Secondpower regulating circuitry 832 may be electrically coupled to battery830 and RF processing circuitry 834. Second power regulating circuitry832 may be operable to, for example, convert power from battery 830 intoa condition suitable for core processing circuitry 824 (e.g., bychanging the voltage or regulating the current flow).

Switch 810 may be electrically coupled to both core processing circuitry824 and RF processing circuitry 834. Switch 810 may be controlled by thepresence of an external power source on bus 820. For example, switch 810may be activated when the voltage of bus 820 goes below a predeterminedthreshold. When switch 810 is activated, first power regulatingcircuitry 822, core processing circuitry 824, RF processing circuitry834, and second power regulating circuitry 832 may be electricallycoupled such that both core processing circuitry and RF processingcircuitry can share power.

Control circuitry 840 can be electrically coupled to bus 820, firstpower regulating circuitry 822, core processing circuitry 824, andsecond power regulating circuitry 832. Control circuitry 840 may be ableto selectively activate first power regulating circuitry 822 and secondpower regulating circuitry 832 based on bus 820, core processingcircuitry 824, and/or any other signals in the electronic device.

FIG. 9 shows wireless headset 900 in accordance with an embodiment ofthe present invention. Headset 900 can be an electronic headset forcommunications (see e.g., headset 10 of FIG. 1). Headset 900 can includeprocessor circuitry 910 that has a first power consumption portion 912and a second power consumption portion 914. First power consumptionportion 912 can, for example, include the core circuitry of anelectronic device (e.g., boot-up circuitry), while second powerconsumption portion 914 can include the device's auxiliary circuitry(e.g., circuitry for RF communications). Headset 900 can further includepower distribution circuitry 920. Power distribution circuitry 920 canselectively power first power consumption portion 912 independent ofwhether second power consumption portion 914 is powered. In someembodiments, power distribution circuitry 920 can selectively power anycombination of first power consumption portion 912 and second powerconsumption portion 914 based on one or more monitored conditions ofheadset 900. For example, power distribution circuitry 920 can monitorif an external power source is present and/or the charge level of aninternal battery in order to determine which power consumption portionsto activate.

FIGS. 10A and 10B show perspective views of an illustrative headset inaccordance with an embodiment of the present invention. Headset 1000 cancorrespond to headset 10 of FIG. 1. For example, primary housing 1010can correspond to primary housing 11 and earbud 1020 can correspond toearbud 12.

Headset 1000 can include a housing that encloses the electronic andother elements of the headset. The housing can incorporate severalpieces that are assembled using any suitable process (e.g., adhesive,screws, or press fit). In the example of FIGS. 10A and 10B, headset 1000can include earbud 1020, neck 1030, primary housing 1010, antenna cap1011 and connector 1040. Earbud 1020 can include perforations (e.g.,acoustic ports) 1021 and 1022 for allowing air to pass into and out ofthe earbud 1020. Front port 1021 can allow sound waves from a receiverlocated in earbud 1020 to reach a user's ear and/or the outsideenvironment. Side ports 1022 can provide a path for acoustic pressure tovent to the outside environment. Earbud 1020 can be attached to primaryhousing 1010 by neck 1030.

Attached to one end of primary housing 1010 is antenna cap 1011. Antennacap 1011 can have button 1012 disposed at least partially therethrough.A user can interface with button 1012 to control the headset. Primaryhousing 1010 can include display 1013 which can correspond to displaysystem 700 of FIG. 7 or display system 18 of FIG. 1. In someembodiments, display 1013 may include microperforations such as thosediscussed in more detail below in connection with FIGS. 48 and 49.Located at the connector end of primary housing 1010, connector 1040includes at least one port (not shown in FIG. 10A) for enabling amicrophone inside housing 1010 to receive acoustic signals (e.g., auser's voice), and at least one contact 1042 for receiving power, data,or both from an external source. Connector 1040 may correspond tocontact regions 211, 212, and 213 of FIG. 2, for example.

Earbud 1020, neck 1030, primary housing 1010, antenna cap 1011 andconnector 1040 can be constructed from any suitable material including,for example, metal, plastic, silicone, rubber, foam, or combinationsthereof. For example, earbud 1020 can be formed from a plastic elementsurrounded by a silicone seal and primary housing 1010 can be formedfrom aluminum. Earbud 1020, neck 1030, primary housing 1010, antenna cap1011 and connector 1040 can be manufactured using any suitable process(e.g., molding, casting or extrusion). In some embodiments, earbud 1020,neck 1030, primary housing 1010, antenna cap 1011 and connector 1040 canbe post processed to provide texture and other features on the inner orouter surfaces of the bodies. For example, a bead blast and anodizationprocess can be used to apply a desired surface texture to primaryhousing 1010.

FIG. 11 is an exploded view of headset 1100 in accordance with anembodiment of the present invention. Headset 1100 can correspond toheadset 10 of FIG. 1 or headset 1000 of FIGS. 10A and 10B, for example.In one embodiment of the present invention, earbud housing 1120 cancontain earbud circuit board 1122. Earbud circuit board 1122 can, forexample, correspond to earbud circuit board 522 of FIG. 5. Earbudcircuit board 1122 can be a flexible circuit board on which one or moreof the following components are electrically and/or mechanicallymounted: processor 1123 (which can be used to control the functions ofheadset 1100), receiver 1124, and other circuitry and components. Theflexible nature of earbud circuit board 1122 can enable it to be foldedonto itself, providing layers of circuitry that can be packed intoearbud housing 1120, thereby occupying space within earbud housing 1120that may otherwise be empty and unused. The flexible portions of earbudcircuit board 1122 can replace the need for separate wires connectingdifferent circuit boards, which might cause a substantial increase insize because, for example, each wire might involve a pair of connectors.Additionally, the flexible nature of circuit board 1122 canadvantageously reduce the area or footprint required by circuit board1122. That is, compared to another circuit board having similarcircuitry and components disposed thereon but in an unfolded layout,circuit board 1122 can occupy less area. In addition, circuit board 1122further can reduce the footprint or size requirements of othercomponents of headset 1100, such as primary housing 1110 and antenna cap1111, by incorporating within earbud housing 1120 electronics and othercomponents that traditionally are located elsewhere within a headset.Earbud housing 1120 and the circuitry and components contained thereinare discussed in more detail below in connection with FIGS. 18-27B, forexample.

Earbud housing 1120 can be coupled to primary housing 1110 by neck 1130.Earbud housing 1120, primary housing 1110, and neck 1130 can correspond,respectively, to earbud housing 610, primary housing 630, and neck 620of FIG. 6A. Neck 1130 can be constructed with a double threaded screwinsert to receive screw member 1131 (associated with earbud housing1120) and screw member 1132 (associated with primary housing 1110). Neck1130 can connect earbud housing 1120 and primary housing 1110 in amanner that can reduce the likelihood of earbud housing 1120 and primaryhousing 1110 rotating independently of each other. That is, when headset1100 is in use and the user adjusts its position by, for example,pulling primary housing 1110 down, the earbud housing 1120 can rotate inconjunction with primary housing 1110. However, in some embodiments,pulling primary housing 1110 down may cause the housing to rotate withrespect to earbud housing 1120 so as to trigger a switch and signify auser input. A more detailed discussion of headset necks and theirassembly can be found below in connection with FIGS. 28-30, for example.

In addition to earbud circuit board 1122, headset 1100 also can includeprimary housing circuit board 1115 on which additional electroniccomponents 1113 can be electrically and/or mechanically mounted. Primaryhousing circuit board 1115 may, for example, correspond to primaryhousing circuit 512 of FIG. 5. Primary housing circuit board 1115 can beelectrically coupled with the earbud circuit board by one or more wires,cables, flexible circuit boards, and the like. The arrangement ofelectronic components in both earbud circuit board 1122 and primaryhousing circuit board 1115 can advantageously reduce the size of headset1100. The arrangement of the electronic components in headset 1100 willbe discussed in more detail below in connection with FIGS. 18-20C, forexample.

A user can control the functions of headset 1100 using button 1112,which can be electrically coupled with primary housing circuit board1115. Button 1112 can extend from antenna cap 1111 such that it appearsas a discrete user interface easily activated by a user. Button 1112 canbe configured to move in any suitable manner including, for example,bending with respect to primary housing 1110, translating in and out ofantenna cap 1111, rotating around an axis passing through connectorplate 1141 and button 1112, or any combination thereof.

In one embodiment, button 1112 can include a switch such as a domeswitch, which can be activated when a user depresses button 1112. Button1112 can have a button guide structure. The button guide structure canhave one or more guide channels to facilitate user actuation of thebutton with respect to the rest of headset 1100. In one embodiment ofthe present invention, the guide channel(s) can be provided in the formof a hole through the button guide structure. The switch actuationmember can have a stem that is supported and guided by the guidechannel. When pressed by a user, the switch actuation member moves alongthe guide channel towards the switch. Raised structures (e.g., ribs) canbe used to ensure that the switch actuation member reciprocates smoothlywithin the guide channel.

Button 1112 and antenna cap 1111 can be constructed from a dielectricmaterial such as plastic. Antenna 1118 can be formed by mounting anantenna resonating element within antenna cap 1111 (e.g., along an innersurface of antenna cap 1111) or on a portion of the button guidestructure. Constructing button 1112 and antenna cap 1111 from adielectric material can reduce or eliminate potential signalinterference that can disrupt the proper operation of antenna 1118. Inaddition, a dielectric button 1112 can allow for smaller clearancebetween the antenna resonating element and conductive structures (e.g.,primary housing circuit board 1115) in headset 1100.

Antenna 1118 can be electrically coupled with primary housing circuitboard 1115 so that it can send and receive wireless (e.g., radio)signals. Antenna 1118 can include any suitable antenna resonatingelement for communicating between headset 1100 and an electronic device(e.g., a cellular telephone or a personal media device). The antennaresonating element can be formed from a flex circuit containing a stripof conductor. The flex circuit can be attached to the button guidestructure using, e.g., adhesive. For example, the flex circuit cancontain registration holes that mate with corresponding registrationbosses on the button guide structure. One or more of the bosses can beheat staked to the flex circuit.

Details about the operation and design of an antenna and button systemsimilar to antenna 1118 and button 1112 can be found, e.g., in U.S.patent application Ser. No. 11/651,094 entitled “Antenna and ButtonAssembly for Wireless Devices,” which is incorporated herein.

Appendages 1117 can be incorporated into antenna cap 1111 in order tomount the antenna cap to headset 1100. Appendages 1117 can, for example,fasten to primary housing 1110 or one or more brackets 1116 which willbe discussed in more detail below.

Battery pack 1119 can be located within primary housing 1110. Batterypack 1119 can contain one or more suitable batteries including, forexample, lithium ion, lithium ion polymer (Li-Poly), nickel metalhydride, or any other type of battery. Battery pack 1119 can beelectrically coupled with circuit board 1115 for powering electroniccomponents in headset 1100. Additionally, circuitry that is typicallypackaged within standard battery packs (e.g., charging or fuseprotection circuitry) can be moved to primary housing circuit board1115. Advantageously, the distribution of circuitry into earbud housing1120 and the layout of circuit board 1115 can permit battery pack 1119to occupy a substantial portion of the internal space of primary housing1110. This can increase the energy storage capacity of headset 1100(e.g., allow headset 1100 to operate for longer period of time inbetween charges) without increasing the size of primary housing 1110 andheadset 1100.

Headset 1100 can include connector 1140 for enabling headset 1100 toelectrically connect to other devices. An opening or port can beincluded in connector 1140 so that acoustic signals (e.g., speech from auser) can reach the microphone inside microphone boot 1144. Connector1140 can, for example, correspond to assembly 320 of FIG. 3 or assembly420 of FIG. 4, for example. The microphone can be electrically coupledwith circuit board 1115 in any suitable manner. Microphone boot 1144 canbe placed inside the end of primary housing 1110 that is farthest fromearbud housing 1120. This end may be referred to herein as themicrophone or connector end of headset 1100, and is also the portion ofheadset 1100 that is closest to the user's mouth when in use. Thearrangement of the microphone boot 1144 with respect to connector 1140and accompanying parts is discussed in more detail below in connectionwith the description accompanying FIGS. 50A-54.

Connector 1140 can include connector plate 1141 in which contacts 1142and accompanying casing 1143 can reside. As such, contacts 1142 canfacilitate the electrical coupling of headset 1100 with another device.Accompanying casing 1143 can be made from a non-conductive material(e.g., a polymeric material). Casing 1143 can surround contacts 1142 toprevent the contacts from electrically coupling with connector plate1141. Contacts 1142 and casing 1143 can be substantially flush with thesurface of connector plate 1141 so that the combination of the contacts,casing and plate creates a substantially flat surface for mating withother connectors. Connector plate 1141 can be made of a ferromagneticmaterial so that it is biased to magnetic connectors, such as thosediscussed in connection with FIGS. 62A-67B, for example. The design ofconnector plate 1141, contacts 1142, casing 1143 and complementarymagnetic connectors will be described in more detail below in connectionwith the discussion of FIGS. 55A-67B.

Headset 1100 can include one or more brackets 1116 to couple connector1140 with appendages 1117 of antenna cap 1111. Brackets 1116 can preventconnector plate 1141 and antenna cap 1111 from moving axially away fromeach other or separating from primary housing 1110. Alternatively,connector plate 1141 and antenna cap 1111 can be coupled to one or morebrackets that are secured to the inner surface of primary housing 1110.

As a matter of design choice, a seam can be included in between theperipheral surface of connector plate 1141 and the inner surface ofprimary housing 1110. That is, in addition to the predefined port forproviding an acoustic pathway between the microphone and the outsideenvironment, gaps can exist. These gaps can advantageously enable themicrophone to receive acoustic signals in the event the predefinedacoustic pathway is blocked (e.g., by a foreign object such as dirt). Inother embodiments, an adhesive may be applied to provide a substantiallyairtight seal between connector plate 1141 and primary housing 1110. Inyet another embodiment, a gasket may be used to provide a seal.

FIG. 12 shows a view of headset 1200 in accordance with anotherembodiment of the present invention. Headset 1200 can be similar toheadset 1100, but with some substantial differences between the two. Forexample, headset 1200 can use a different attachment technique to coupleconnector 1240 to primary housing 1210. Connector 1240 can include tabs1242 which can be used to couple with features (e.g., wall 1212) on aninterior surface of primary housing 1210. Such a method might beadvantageous to using the brackets 1116 in headset 1100. For example,the tabs 1242 can attach to the near end of primary housing 1210 whichmight provide connector 1240 with higher structural integrity than, forexample, the method of using brackets to attach to a structure (e.g.,antenna cap) on the other end of the primary housing. Headset 1200 canalso include light diffuser 1244 which can be used in conjunction with avisual indicator system as discussed in connection with FIGS. 48 and 49.Additionally, headset 1200 can include antenna 1218 which can wraparound button guide 1217 in some embodiments.

The fundamental basics of the Bluetooth protocol are well known in theart, and discussed briefly below. For a more detailed discussion, pleasesee Bluetooth Specification Version 2.0+EDR, Vol. 0, Nov. 4, 2004, whichis hereby incorporated by reference in its entirety. Bluetooth wirelesstechnology is based on an international, open standard for allowingintelligent devices to communicate with each other through wireless, lowpower, short-range communications. This technology allows any sort ofelectronic equipment, from computers and cell phones to keyboards andheadphones, to make its own connections, without wires or any directaction from a user. Bluetooth is incorporated into numerous commercialproducts including laptop computers, PDAs, cell phones and printers, andis likely to be used in future products.

Bluetooth can be referred to as a frequency hopping spread spectrum(FHSS) radio system that operates in the 2.4 GHz unlicensed band.Bluetooth transmissions change frequencies based on a sequence which isknown to both the transmitter and the receiver. According to one knownstandard, Bluetooth transmissions use 79 different frequencies rangingfrom 2.404 GHz to 2.480 GHz. Bluetooth's low power transmissions allow atypical range of about 10 meters or roughly 30-40 feet. This range canvary from about 1 meter to 100 meters depending on the amount of powerused by the device for Bluetooth transmissions.

Bluetooth devices connect to each other to form networks known aspiconets. A piconet includes two or more devices which are synchronizedto a common clock signal and hopping sequence. Thus, for any device toconnect to a given piconet, that device may need to have the same clocksignal and hopping sequence. The synchronized clock and hopping sequencecan be derived using the clock signal of one of the devices on thepiconet. This device is often referred to as the “master” device whileall other devices on the piconet are referred to as “slave” devices.Each piconet can include one master device and up to seven or more slavedevices. Moreover, Bluetooth devices can belong to more than onepiconet. The term “scatternet” is used to define Bluetooth networkswhich are made up of multiple, overlapping piconets. In the case whereone Bluetooth device is on two or more piconets, all of the devices areon a single scatternet. Devices from one of the piconets can communicatewith devices from another piconet by using the shared device to relaythe signals.

When two Bluetooth devices initially connect, they first share somegeneral information (e.g., device name, device type) with each other. Inorder to enhance the connection, the devices can establish a trustedrelationship by using a secret passkey. This passkey is typicallyprovided by a user or stored on memory in a device. According to a knownBluetooth standard, the process of establishing this trustedrelationship is called pairing. Once two devices are paired, theytypically share information and accept instructions from one another.

Bluetooth devices can operate with a maximum data throughput ofapproximately 2.1 Mbit/s (Megabits-per-second), but it is understoodthat such limitations change as technology advances, and thatembodiments of the present invention may operate at other rates. Thismaximum throughput is shared among all devices on a piconet, meaningthat if more than one slave device is communicating with the master, thesum of all communications is less than the maximum data throughput.

The Bluetooth standard includes a published software framework. Theshared framework is called the Bluetooth Protocol Stack and includesdifferent software applications to implement Bluetooth communications.FIG. 13 is a simplified schematic diagram of an exemplary BluetoothProtocol Stack 1300 in accordance with an embodiment of the presentinvention. Low-level software is included in Lower Stack 1302. Thissection includes code to generate/receive radio signals, correcttransmission errors and encrypt/decrypt transmissions, among otherthings. The Host Controller Interface (HCI) 1304 is a standardizedinterface between the low-level Bluetooth functions and applications.The HCI layer represents a division between the Lower Stack 1302functions handled by a dedicated Bluetooth processor and the rest of thefunctions handled by an application-specific processor.

The Extended Synchronous Connection-Oriented (eSCO) 1306 layer is usedto implement dedicated communication channels, commonly used for voicedata, in between the Lower Stack 1302 and high-level applications. TheLogical Link Control and Adaptation Protocol (L2CAP) 1308 layer combinesand repackages the data transmitted and received by the multiplehigher-level applications. The L2CAP 1308 layer combines all of thesedifferent communications into one data stream that can interface withLower Stack 1302 The RFCOMM 1310 layer emulates the protocol used byserial connections. This allows software designers to easily integrateBluetooth into existing applications which previously used a serialconnection. The Service Discovery Protocol (SDP) 1312 layer is used bydevices to provide information about what services (or functions) eachdevice offers and how other devices can access those services throughBluetooth.

The Profiles 1314 layer allows a device to identify itself as a memberof a generic group of devices with a predefined set of functions. Forexample, a device complying with the headset profile may supportpredefined methods relating to audio communications. The ApplicationLayer 1316 contains programs that implement the useful tools created byall of the other layers. By writing different programs for ApplicationLayer 1316, software developers can focus on new uses of the Bluetoothfunctionality without having to rewrite the code which controls theunderlying communication tasks.

FIG. 14 shows a simplified block diagram of exemplary electronic system1400 of a headset in accordance with an embodiment of the presentinvention. The system of 1400 can be implemented in, for example,headset 10 of FIG. 1 or headset 1000 of FIGS. 10A and 10B. System 1400can include processor circuitry 1410, interface circuitry 1420, powerdistribution circuitry 1430, switching circuitry 1440 and 4-pinsymmetrical magnetic connector 1455.

Processor circuitry 1410 can include processor 1411 and auxiliarycircuitry that operates in connection with processor 1411. Processor1411 can coordinate all of the operations in system 1400, including, forexample, Bluetooth transmissions, battery charging and processing (e.g.,encoding and decoding) of acoustic signals. Processor 1411 can drivereceiver 1412 to provide acoustic signals that may be heard by a user.Reset circuit 1413 can detect when system 1400 is connected to anotherdevice and subsequently instruct processor 1411 to reset. Power FET 1414can be used with the power supply circuitry inside processor 1411 andwill be discussed in more detail below in connection with the discussionof FIG. 15. Antenna 1415 can be used to send wireless signals to andreceive wireless signals from another device (e.g., a phone or portablemedia device). UART multiplexer 1416 can be electrically coupled withprocessor 1411 and can route data signals to different parts ofprocessor 1411. This routing can reduce unwanted effects, such asinductance, in unused data lines.

Interface circuitry 1420 can include a microphone isolation LDO 1421, amicro-electro-mechanical (MEMs) microphone 1422, LED driver 1424 andswitch 1423. Microphone isolation LDO 1421 can be electrically coupledwith MEMs microphone 1422. Microphone isolation techniques and MEMsmicrophones are well known, and a person of ordinary skill in the artwill appreciate that these elements can be replaced by other equivalentmicrophone configurations without deviating from the spirit of thepresent invention. LED driver 1424 can be configured to drive a LEDdisplay unit based on one or more outputs of processor 1411. Detailsabout the design and function of circuitry similar to LED driver 1424can be found in U.S. Patent Application No. 60/878,852 entitled “Systemsand Methods for Compact Multi-State Switch Networks,” which isincorporated herein. Switch 1423 can represent the electrical behaviorof button 1012 of FIG. 10B. A user can interface with this switch toinput commands to the headset. For example, a user can depress switch1423 to initiate a telephone call, terminate a call, or both. In oneembodiment, switch 1423 can be a single-pole, single-throw switch with aspring to bias it to an open position.

Power distribution circuitry 1430 can include over-voltage protectionand fuse 1431, battery protection circuitry 1432 and thermistor 1433.Over-voltage protection and fuse 1431 can protect system 1400 in theevent that an unsafe amount of voltage is applied to one or more inputs.The fuse in the protection circuitry can be an over-current protectiondevice which disconnects the inputs of the headset if an over-currentcondition is detected. Battery protection circuitry 1432 can includecircuitry to prevent the malfunction of a battery (e.g., a li-polybattery) which could result in a dangerous overheating situation.Battery protection circuitry 1432, in contrast to conventional headsetswhich has such circuitry integrated into the battery pack, can beseparated from the battery pack and located elsewhere within a headsetaccording to the invention. Thermistor 1433 can be located in theproximity of a battery (see e.g., battery pack 1119 of FIG. 11) and maychange its resistance based on the battery's temperature. One or moreinputs of processor 1411 can be electrically coupled with thermistor1433 to monitor the temperature of the battery. Processor 1411 can beprogrammed to charge the battery differently depending on the detectedbattery temperature. For example, processor 1411 may charge the batteryat a faster rate when the monitored battery temperature is low than whenthe temperature is high. By regulating the charging in this manner, thetime required to completely charge a battery can be decreased withoutdamaging the battery.

Symmetrical magnetic connector 1455 can allow system 1400 to connect toother devices and systems for communicating data or transmitting power.Connector 1455 represents the electrical behavior of connector 16 ofFIG. 1, for example.

Switching circuitry 1440 can enable connector 1455 to connect andcommunicate with many different types of devices and in many interfaceorientations. Switching circuitry 1440 can, for example, correspond toswitching circuitry 215 of FIG. 2. Switching circuitry 1440 can includepower polarity switch circuit 1441 and data polarity switch circuit1442. The two circuits can, for example, determine the type ofcommunication interface being used and route the corresponding dataand/or power lines to the correct pathways (e.g. internal electricaltraces) for the detected interface. The two circuits can also determinethe interface orientation of a connection with another device, forexample, and route the corresponding data and/or power lines to thecorrect pathways (e.g., internal electrical traces) for the detectedorientation. A detailed description of the design and function ofexemplary circuits similar to switch circuits 1441 and 1442 can be foundin U.S. patent application Ser. No. 11/650,130 entitled “Systems andMethods for Determining the Configuration of Electronic Connections,”which is incorporated herein.

FIG. 15 shows processor 1500 which can be used as the core processor orapplication processor of a headset in accordance with an embodiment ofthe present invention. Processor 1500 can, for example, correspond toprocessor 20 of FIG. 1. Processor 1500 can also be referred to as aSystem on a Chip (SoC) because it can be a single integrated circuitcapable of a diverse range of functions. Processor 1500 can be a CSRBC04 Audio Processor with integrated Flash Memory that fully supportsthe Bluetooth v2.0+EDR specification. An oscillator 1510 and clockgeneration circuitry 1511 can be used in conjunction with a timingcrystal to establish a timing signal (or clock) which processor 1500 canuse to coordinate its activities. RF circuitry 1520 can be used to inputand output RF signals for wireless communications. Baseband circuitry1530 can coordinate communications so that they conform with the acommunications protocol (e.g., a Bluetooth protocol). Flash memory 1531can store, for example, software and configuration information forprocessor 1500. Random access memory (RAM) 1532 can temporarily storedata for Baseband circuitry 1530 and microprocessor 1533. RISCmicroprocessor 1533 can be programmed to perform various functions, suchas monitoring a thermistor (see e.g., thermistor 1433 of FIG. 14) andcoordinating battery charging as previously described, for example.

Full speed USB controller 1540 and UART circuitry 1541 can facilitatewired communication interfaces so that processor 1500 can share datawith another device through a physical interface (e.g., connectorcontacts 1042 of FIG. 10A). In one embodiment, processor 1500 cansupport both full speed USB and simplified RS-232 serial interfaces. Asimplified RS-232 interface can include, for example, three lines:transmit data, receive data, and ground. In order to accommodate morethan one interface over a limited number of data lines, USB controller1540 and UART circuitry 1541 can be coupled to a switch (e.g., UARTMultiplexer 1416 of FIG. 14). This switch can route data lines to thecircuitry, within processor 1500, that corresponds to the communicationinterface being used. A more detailed discussion of similar systems andmethods for using more than one communications interface over a limitednumber of data lines can be found in U.S. patent application Ser. No.11/650,130 entitled “Systems and Methods for Determining theConfiguration of Electronic Connections,” which is incorporated herein.Processor 1500 can also support other interfaces in addition to thosediscussed above without deviating from the spirit of the presentinvention. For example, processor 1500 can include circuitry forsupporting a proprietary communications interface.

Processor 1500 can include differential microphone input amplifier 1551and differential speaker output amplifier 1552. Both the input amplifier1551 and the output amplifier 1552 can be electrically coupled withAudio CODEC 1550 to process (e.g., encode and decode) audio signals.Power control and regulation circuitry 1560 can include low-dropoutregulator (LDO) 1561, battery charger 1562 and switch mode power supply(SMPS) 1563. The power needed for the various subsystems of processor1500 can be regulated by LDO 1561 or SMPS 1563 depending on both thecharge level of the battery and any external power sources that might beconnected. This will be described in more detail below in connectionwith the discussion of FIG. 16. Battery charger 1562 can output acontrollable current between 25 and 100 milliamps to charge a battery(see e.g., battery pack 1119 of FIG. 11). In accordance with anembodiment of the present invention, this controllable current can varybased on various factors (e.g., the detected temperature of thebattery).

Programmable I/O 1570 can include LED driver 1571 and analog-to-digitalconverter (ADC) 1572. LED driver 1571 can use signals from othercircuitry in processor 1500 to generate signals with sufficient currentto illuminate one or more indicator LEDs. The design and operation ofexemplary circuitry similar to LED driver 1571 can be found in U.S.Patent Application No. 60/878,852 entitled “Systems and Methods forCompact Multi-State Switch Networks,” which is incorporated herein.Analog-to-Digital Converter (ADC) 1572 can accept inputs from analogcircuitry and convert them to digital signals to be used by othercircuitry in processor 1500. For example, ADC 1572 can monitor thecurrent running through a thermistor (see e.g., thermistor 1433 of FIG.14) to determine the temperature of a battery. Circuitry in processor1500 can use this temperature information to determine an appropriatecharging current for battery charger 1562 to provide. Moreover, it isunderstood that ADC 1572 can process multiple analog signalsconcurrently. For example, in addition to the temperature informationabove, ADC 1572 can also process voltage information about the currentcharge level of a headset's battery.

While the processor described above and shown in FIG. 15 is a CSR BC04Audio Processor, other processors with other configurations andfunctionality can be used in a headset without deviating from the spiritof the present invention.

FIG. 16 shows a simplified schematic of power distribution system 1600for the subsystems of processor 1605 in accordance with an embodiment ofthe present invention. System 1600 can, for example, correspond tosystem 800 of FIG. 8 and headset 900 of FIG. 9. Moreover, processor 1605can correspond to processor 1500 of FIG. 15. Processor 1605 can includeboth low-dropout regulator (LDO) 1620 and switch mode power supply(SMPS) 1625 as options for regulating power for processor 1605. SMPS1625 can output power with a higher efficiency than LDO 1620, but canrequire the installation of several additional components, such as arelatively large capacitor and inductor, which can increase the cost(and size) of system 1600. In addition, SMPS 1625 may require an inputvoltage that meets, or exceeds, a predetermined voltage level tooperate. Therefore, it may be a matter of design choice as to whichpower supply is used. For example, in low voltage applications, it maybe advantageous to use LDO 1620. In other embodiments, such as the oneshown in FIG. 16, LDO 1620 and SMPS 1625 can both be used to providefunctionality over a wide range of input voltages and high powerefficiency.

FIG. 16 shows processor 1605 which includes core circuitry 1610 andradio circuitry 1615 in accordance with an embodiment of the presentinvention. Radio circuitry 1615 can include, for example, circuitryrelated to RF communications. Additional functions (e.g., low-levelsystem functions, firmware updates) can be executed by core circuitry1610. Additionally, core circuitry 1610 can monitor and control othercircuitry in system 1600 using, for example, input line 1614 and outputlines 1611, 1612 and 1613.

Power distribution system 1600 can include circuitry for interfacingwith two power sources. In FIG. 16, an internal battery is representedby BAT 1655, and an external power supply is represented as BUS 1650.From herein, the voltage of BAT 1655 will be referred to as VBAT. BUS1650 can, for example, represent the power provided by a battery chargerthat is connected to system 1600. BUS 1650 can be electrically coupledwith LDO 1620 such that the LDO draws power from an external sourcethrough BUS. Therefore, LDO 1620 operates when an external power supplyis connected to system 1600. Similarly, SMPS 1625 can be electricallycoupled with BAT 1655 so that it draws power from the battery.

Other circuitry in power distribution system 1600 can include Power FET1640, Analog-to-Digital Converter (ADC) 1630 and logic gates 1661, 1631and 1632. Button 1660 can represent, for example, a signal from anon/off switch or other circuitry that can signal processor 1605.

An illustrative operation of system 1600, in which BAT 1655 is the onlysource of power, is now discussed. An absence of power on BUS 1650prevents LDO 1620 from supplying power and causes FET 1640 to turn on,thereby effectively coupling nodes 1641 and 1642. System 1600 may beturned on when button 1660 is activated and outputs a high voltage.Activation of button 1660 can cause the button input of gate 1661 to goHIGH, which can cause the output of the gate 1661 to go HIGH. This HIGHsignal can cause gate 1632 to assert a HIGH signal on its output. Whengate 1632 outputs a high voltage, SMPS 1625 is activated and can beginproviding power, if VBAT is at or above the predetermined voltage level(e.g., BAT 1655 has sufficient power to run SMPS 1625). Because powerFET 1640 is on, the power provided by SMPS 1625 can be transmitted toradio circuitry 1615 and core circuitry 1610. As core circuitry 1610begins to boot up, it can output a HIGH signal on line 1613 so that gate1632 continues to output a HIGH signal after button 1660 is released.System 1600 can operate with full functionality at this point becauseboth core circuitry 1610 and radio circuitry 1615 are receiving power.However, when VBAT drops below the predetermined voltage level (e.g.,BAT 1655 is dead), SMPS may no longer be able to produce reliable powerand system 1600 may begin to shut down.

An illustrative operation of system 1600 receiving power from anexternal power source on BUS 1650 is now discussed. The power on BUS1650 can provide supply power to LDO 1620 and cause power FET 1640 toturn OFF or remain turned OFF, effectively decoupling nodes 1641 and1642. Additionally, the power on BUS 1650 can cause gates 1661, 1631 and1632 to output HIGH signals. When gate 1631 generates a HIGH signal, LDO1620 can begin supplying power. Power from LDO 1620 may be provided tocore circuitry 1610, but not to radio circuitry 1615, because power FET1640 is not conducting. When core circuitry 1610 receives power, it canoutput a HIGH signal on line 1611 which causes the output of gate 1631to maintain a HIGH signal so that LDO 1620 can continue operating.

SMPS 1625 may not be able to operate until VBAT has risen to or abovethe predetermined voltage level. Core circuitry 1610 can instructbattery charging circuitry (not shown) to begin using power from BUS1650 to charge BAT 1655. Core circuitry 1610 can receive signals (e.g.,digital signals) from ADC 1630 over line 1614. ADC 1630 can beelectrically coupled with BAT 1655. ADC 1630 can convert a signal with avarying voltage (e.g., VBAT) into a digital signal that can be processedby core circuitry 1610. When VBAT has met or exceeded the predeterminedvoltage level, SMPS 1625 may now be able to operate and provide radiocircuitry 1615 with power. Note that in some embodiments, SMPS 1625 maybe powered ON substantially immediately when an external power serviceis connected to BUS 1650. Using ADC 1630, core circuitry 1610 can detectwhen SMPS turns on and coordinate the functions of processor 1605accordingly. For example, when radio circuitry 1615 is powered, corecircuitry 1610 can begin sending communications data to radio circuitry1615. In this manner, processor 1605 can operate with full functionalitybefore BAT 1655 is fully charged.

While BAT 1655 is charging, core circuitry 1610 can perform variousother functions, regardless of whether VBAT has met or exceeded thepredetermined voltage level. For example, core circuitry 1610 can runboot up processes, communicate over wired interfaces and run userinterfaces. In this manner, core circuitry 1610 can, for example, handleauxiliary processes (e.g., downloading firmware updates via a wiredinterface and installing the updates) before processor 1605 has fullfunctionality.

Several benefits may be realized by power distribution system 1600 inthe manner discussed above. For example, the core circuitry 1610 canturn ON before the battery has reached a minimum charge threshold. Thisenables core circuitry 1610 to handle boot up processes in advance,thereby enabling headset to begin working immediately once the batteryis charged to the minimum level. In effect, certain components may bepowered independent of BAT 1655 when an external power supply isconnected to BUS 1650.

Additionally, system 1600 limits the unnecessary use of BAT 1655.Traditionally, known headset circuitry is powered through a battery evenif an external power supply is present. The power drained from thebattery is then recharged using power from the external power supply.This charging and recharging can shorten a battery's lifespan. System1600 allows core circuitry 1610 to draw power independent of BAT 1655and directly from an external supply (if present), extending the life ofBAT 1655.

To provide additional functionality, output line 1612 can be included incore circuitry 1610 so that the core circuitry can shut down system1600. Line 1612 can be coupled with node 1633 such that line 1612 candrive node 1633 to a LOW signal. Therefore, if core circuitry outputsLOW signals to lines 1611, 1612 and 1613, the output of gates 1631 and1632 go LOW, turning off both LDO 1620 and SMPS 1625, which causes corecircuitry 1610 and radio circuitry 1615 to turn off.

While the previous discussion described a method and system forseparately powering on core and RF radio circuitries, the sametechniques can be applied to other electronic subsystems which, forexample, might be unrelated to RF communications.

FIGS. 17A-17C show different views of known headset circuit boards, withparticular emphasis on how circuitry and components are distributedtherein. Electrical components 1796, including processor 1792, may bemounted on two sides of circuit board 1790. As can be appreciated by oneof skill in the art, circuit board 1790 may occupy a relatively large,undistributed area. Such circuit boards can limit the amount that othercomponents (e.g., batteries, buttons, antennas) are spatially integratedwith the electronics. Thus, known headsets have to be relatively largeto accommodate such boards and other components.

FIG. 18 is a simplified schematic system diagram of a headset showing acircuit board arrangement in accordance with an embodiment of thepresent invention. System 1800 can correspond to headset 500 of FIG. 5,for example. System 1800 can be divided into two independent andseparately arranged circuit boards 1810 and 1820. That is, when boards1810 and 1820 are installed in a headset according to an embodiment ofthe present invention, the boards may be electronically coupled to eachother, but the boards themselves are discrete. Circuit board 1810corresponds to earbud circuit board 522 of FIG. 5 and earbud circuitboard 1122 of FIG. 11 and can include, for example, Bluetooth processor1812, circuitry that requires placement close to the processor, balanceRF filter circuitry 1814 and coaxial connector (see e.g., connector 2752of FIG. 27B). Examples of circuitry requiring close proximity toprocessor 1812 can include a timing crystal, charging inductors,capacitors, field effect transistors and resistors.

Circuit board 1820 corresponds to primary housing circuit board 512 ofFIG. 5 and primary housing circuit board 1115 of FIG. 11 and can, forexample, include RF Antenna 1822, interface circuitry 1823, powerdistribution circuitry 1824, switching circuitry 1825, 4-pin symmetricalmagnetic connector 1826, RF matching circuitry 1821 and coaxialconnector (see e.g., connector 2752 of FIG. 27B).

Circuit boards 1810 and 1820 can be electrically coupled using, forexample, co-ax cable 1830 and bus 1832. In the embodiment shown in FIG.18, bus 1832 includes ten lines, but one of ordinary skill in the artwill appreciate that the number of lines in the bus can vary.

Balance RF filter circuitry 1814 and RF matching circuitry 1821 canadjust RF signals to compensate for the specific effects of circuitboard 1810, co-ax cable 1830, circuit board 1820 and antenna 1822. Thefunctions of elements of additional circuitry in circuit board 1810 and1820 have been described in more detail in the above discussion relatingto FIG. 14.

FIGS. 19A and 19B compare respective top and bottom views of earbudcircuit board 1920 according to an embodiment of the present inventionto respective top and bottom views of the known circuit boards shown inFIGS. 17A-17C. In addition, FIGS. 19A and 19B show that selectedcomponents of known circuit board 1990 can be arranged on earbud circuitboard 1920. For example, as shown, the encircled circuit and componentssuch as components 1996 and processor 1992 can be placed on one or moresides of earbud circuit board 1920. The remaining electronic componentssuch as components 1996 can be placed on primary housing circuit board(see e.g., circuit board 1115 of FIG. 11) which may be located insidethe headset's primary housing.

Earbud circuit board 1920 can include a layer made from a flexiblesubstrate that enables circuit board 1920 to bend onto itself, therebyeffectively reducing the area needed to install circuit board 1920 intoa headset according to the invention. The flexible layer of circuitboard 1920 can include one or more layers of electrical traces forelectrically coupling processor 1922 and electronic components 1926, forexample. The flexible layer of circuit board 1920 can, for example,extend over the entire footprint of the circuit board, or be limited topredetermined portions of circuit board 1920.

Circuit board 1920 can include relatively rigid sections 1923, 1925 and1927 which have increased structural strength and are easier to mountelectrical components to. Rigid circuit board sections 1923, 1925, and1927 can be fabricated by attaching rigid circuit board pieces to one ormore outer surfaces of the flexible layer of circuit board 1920. Rigidpieces can be attached to a flexible layer using any suitable process,such as applying an adhesive, for example. Contacts can be included oncomplementary surfaces of the rigid pieces and the flex layer so thatelectrical traces can be routed across the different layers. One or morelayers of electrical traces can be included in the rigid circuit boardpieces so that the combination of rigid and flex layers can provide twoor more layers of electrical traces. In the embodiment shown in FIGS.19A and 19B, a flex circuit layer with two levels of traces can belocated in between two rigid, single-trace layers such that theresulting rigid sections of circuit board 1920 include four layers oftraces. In flexible sections of circuit board 1920, such as connectorlead 1921, the absence of rigid pieces can result in two levels oftraces.

Rigid sections 1925 and 1927 can have substantially circular footprintswith different radii. Various electrical components, such as capacitorsand resistors, for example, can be mounted on both sides of rigidsection 1925. Rigid section 1927 can have a larger footprint thansection 1925 in order to accommodate the mounting of processor 1922 on afirst side and receiver 1924 on a second side of section 1925. Connector1928 can be mounted to rigid section 1923 to enable earbud circuit board1920 to electrically couple with a primary housing circuit board (seee.g., circuit board 1115 of FIG. 11).

FIGS. 20A and 20B show side and perspective views of earbud circuitboard 2020 in a folded configuration in accordance with an embodiment ofthe present invention. Earbud circuit board 2020 may, for example,correspond to earbud circuit board 1920. The folded configuration maycorrespond to the configuration of circuit board 2020 when installedwithin a headset, or more particularly, the earbud of the headset, asshown in FIG. 20C. Top rigid section 2027 can be folded over middlerigid section 2025 so that both sections can fit in the earbud of aheadset. Processor 2022, receiver 2024 and various other electroniccomponents 2026 may be mounted to earbud circuit board 2020. Electroniccomponents 2026 can include resistors, capacitors, transistors,amplifiers and other types of both passive and active electroniccomponents, for example. It is to be understood that the term electroniccomponents, as used herein, does not include interconnect devices (e.g.,wires, traces, connectors, etc.). Earbud circuit board 2020 can furtherinclude rigid section 2023 and connector 2028 mounted thereon. Connector2028 can be used to electrically couple earbud circuit board 2020 with acircuit board in a headset's primary housing (see e.g., circuit board1115 or circuit board 2011).

Referring now to FIG. 20C, which shows earbud circuit board 2020 andprimary housing circuit board 2011 installed in a possible configurationwithin headset 2000 in accordance with an embodiment of the presentinvention. Circuit board 2020 can be folded in a configuration similarto that of FIGS. 20A and 20B and inserted into earbud 2014. Primaryhousing circuit board 2011 can include a combination of rigid andflexible sections that are similar, in composition but not necessarilyshape, to the rigid and flexible sections of circuit board 2020. Circuitboard 2011 can be folded to provide a cavity 2012 for a battery (seee.g., battery pack 1119 of FIG. 11). Circuit board 2011 can includeconnector 2018 which may connect to connector 2028 of earbud circuitboard 2020. During installation, circuit board 2011 can be insertedthrough one of the open ends of primary housing 2010. Connector lead2021 can be fed through headset neck 2013 so connector 2028 can matewith connector 2018 when circuit board 2011 has been inserted intoprimary housing 2010.

This distribution of electronics, where processor 2022 and othercircuitry (e.g., receiver 2024 and other electronic components 2026) arelocated inside earbud 2014, advantageously allows for a generallysmaller and more comfortable headset. Although the discussion above isrelated to an embodiment in which a certain distribution of electroniccomponents is used, other distributions can be used without deviatingfrom the spirit of the present invention. For example, a battery can beplaced inside the earbud and a processor can be placed in the primaryhousing.

FIG. 21A shows a perspective view of earbud housing 2100 and neck 2110in accordance with an embodiment of the present invention. Bezel 2130can cover the top of earbud housing 2100. One or more acoustic ports2102 can be located in the wall of the earbud to allow pressure to ventout of earbud housing 2100.

FIG. 21B shows an exploded view of earbud housing 2100 of FIG. 21A inaccordance with an embodiment of the present invention. Screens 2131 and2132 can be located on top of bezel 2130. Screens 2131 and 2132 can, forexample, provide dust protection and acoustic resistance. Top gasket2134 can be attached to the underside of bezel 2130 to create a sealwith receiver 2124, and bottom gasket 2123 can be attached to section2127 (a rigid section) of circuit board 2120. Bracket 2135 can be usedto mount circuit board 2120 inside earbud housing 2100. Mesh can coveracoustic ports 2102 and can, for example, impose acoustic resistance onair passing through those ports. Screw 2112 can be used to mount earbudhousing 2100 to neck 2110. Gaskets 2134 and 2123 can be made of, forexample, foam, rubber, or any other compressible material so that thegaskets can form acoustic (e.g., substantially air-tight) seals withsurrounding parts.

FIG. 22 shows an interior view of empty earbud housing 2200 inaccordance with an embodiment of the present invention. Mesh 2204 can belocated on the inner wall of housing 2200 to control the flow of airthrough one or more acoustic ports 2202 and prevent foreign objects(e.g., dirt) from entering housing 2200. Mesh 2204 can, for example, beaffixed to housing 2200 using an adhesive. Mesh 2204 can be made ofnylon, plastic, or any other suitable material. Mesh 2204 can provideacoustic resistance to the passage of air between an acoustic volumeinside housing 2200 and the outside environment when the earbud isassembled. Even though only one acoustic port is shown in FIG. 22, anynumber of acoustic ports can be used in accordance with the principlesof the present invention.

FIG. 23 shows rigid section 2327 of an earbud circuit board mountedinside earbud housing 2300 in accordance with an embodiment of thepresent invention. Acoustic port 2328 can be provided in circuit boardsection 2327 to permit air flow through the circuit board. The size,shape and location of acoustic port 2328 can vary depending on, forexample, the acoustic properties of the earbud and the desired soundoutput. If desired, more than one acoustic port may be provided.Although not shown in FIG. 23, a second rigid portion of the earbudcircuit board, such as rigid section 2025 of FIGS. 20A and 20B, may tooinclude one or more acoustic ports. Though such port(s) may not benecessary if sufficient air gaps exist between the inside wall ofhousing 2300 and the second rigid portion.

FIG. 24 shows bottom gasket 2440 mounted onto circuit board section 2427in accordance with an embodiment of the present invention. Bottom gasket2440 can include a combination of, for example, acoustic mesh 2430,adhesive, and foam 2441. Foam 2441 of gasket 2440 can be shaped to fitaround receiver (see e.g., gasket 2740 and receiver 2724 of FIG. 27A)and acoustic port 2428. Mesh 2430 can be shaped to cover port 2428. Inthis manner, acoustic mesh 2430 can cover acoustic port 2428 even thoughfoam 2441 does not. Mesh 2430 can be made of nylon, plastic, or anyother suitable material that can provide acoustic resistance to thepassage of air through port 2428 which couples the acoustic volume undercircuit board section 2427 (see e.g., acoustic volume 2796 of FIGS. 27Aand 27B) with the acoustic volume where the receiver is located (seee.g., acoustic volume 2794 of FIG. 27A).

FIG. 25 shows the underside of bezel 2530 in accordance with anembodiment of the present invention. Bezel 2530 can include rim 2536which extends from the bottom of bezel 2530. Rim 2536 can be ofsufficient height to compress bottom gasket 2440 of FIG. 24 againstcircuit board section 2427 of FIG. 24 when bezel 2530 is mounted to thetop of the earbud housing, thereby creating an acoustic seal between therim and the circuit board. Gasket 2534 can be, for example, a layer offoam that is affixed to the underside of bezel 2530 using adhesive.Gasket 2534 can be shaped so that it can form a seal with the top of theearbud's receiver when bezel 2530 is mounted to the earbud. Bezel 2530includes acoustic port 2533 for sound to exit an earbud. Screen 2531 canbe located on the topside of bezel 2530 so that the screen completelycovers acoustic port 2533. Screen 2531 can apply an acoustic resistanceto air passing through acoustic port 2533.

FIG. 26A shows the underside of bezel 2630 with receiver 2620 installedin accordance with an embodiment of the present invention. Receiver 2620can be placed inside rim 2636 so that the front output of receiver 2620is encircled by the seal formed between the top of the earbud's receiverand the top gasket (see e.g., top gasket 2134 of FIG. 21B). Receiver2620 can include spring contacts 2622 and 2624. Spring contacts 2622 and2624 can, for example, be made from a metal or an alloy. Springs contact2622 and 2624 can electrically couple with circuitry in a headset inorder to input audio signals to receiver 2620.

FIG. 26B shows a cross-sectional view of receiver 2620 in accordancewith an embodiment of the invention. Receiver 2620 can include springcontacts 2622 and 2624 which can connect receiver 2620 with a source ofelectrical signals (e.g., earbud circuit board 1115 of FIG. 11).Contacts 2622 and 2624 can include tips 2623 and 2625 to facilitate thephysical contact with a contact on a circuit (e.g. a flex circuitboard).

FIG. 27A shows a cross-sectional view of earbud housing 2700 withreceiver 2724 and circuit board 2720 installed in accordance with anembodiment of the present invention. Bezel 2730 is mounted on top ofearbud housing 2700. Bezel 2730 can be attached to housing 2700 using anotch and rib configuration 2738 or any other suitable method ofattachment, such as adhesive, for example. In an alternative embodimentof the present invention, bezel 2730 can be integrally formed withearbud housing 2700. Neck 2710 can be coupled to the bottom of earbudhousing 2700. Earbud circuit board 2720 can be located inside the earbudand extend through lumen 2716 of neck 2710.

Located on the top of bezel 2730, screens 2731 and 2732 can cover audioport 2733. Audio port 2733 can allow air to pass between the externalenvironment 2798 and front volume 2792 of receiver 2724. Top gasket 2734and bottom gasket 2740 can create acoustic seals around receiver 2724 sothat receiver volume 2794 is created. Acoustic port 2728 can allow airto pass through top rigid section 2727 of circuit board 2720 so that aport between receiver volume 2794 and rear earbud volume 2796 iscreated. Acoustic port 2702 can be located in earbud housing 2700 sothat air can pass between rear earbud volume 2796 and the externalenvironment 2798. Mesh (see e.g., mesh 2204 of FIG. 22) can be appliedto the inner wall of earbud housing 2700 to cover acoustic port 2702such that some resistance is applied to air passing through the port.

In one embodiment of the present invention, receiver 2724 can form atleast part of a wall defining front volume 2792 and at least part of awall defining receiver volume 2794. Rim 2736 of bezel 2730 can extendfrom the bezel into the interior of the earbud and compress againstbottom gasket 2740, thereby also forming at least part of a walldefining receiver volume 2794. In one embodiment of the presentinvention, top rigid section 2727 of circuit board 2720 can be disposedbetween receiver volume 2794 and rear earbud volume 2796, therebyforming at least part of a wall defining receiver volume 2794 and atleast part of a wall defining rear earbud volume 2796. To ensure thedesired acoustic seal between receiver volume 2794 and rear earbudvolume 2796, top rigid section 2727 of circuit board 2720 can be rigidlycoupled to earbud housing 2700, directly or indirectly. In contrast, inone embodiment of the present invention, middle rigid section 2725 ofcircuit board 2720, which can be disposed within rear earbud volume2796, can be flexibly coupled to the earbud housing, directly orindirectly (e.g., via top rigid section 2727 and flexible section 2729of circuit board 2720). As used herein, when a component forms part of awall defining an acoustic volume, the component can do so directly orindirectly. For example, the component can directly form part of a walldefining an acoustic volume when part of the component is open to theacoustic volume. The component can indirectly form part of a walldefining an acoustic volume when the component is incorporated intoanother component open to the acoustic volume.

In order to prevent sound from exiting rear earbud volume 2796 throughlumen 2716, a substance, such as silicon glue, can be used to fill theinside of neck 2710. It is advantageous to prevent sound from receiver2724 leaking into the headset's primary housing (see e.g., primaryhousing 11 of FIG. 1) because the microphone is located therein. Ifsound from the receiver is picked up by the microphone, a potentiallyundesirable echo may be created.

FIG. 27B shows a cross-sectional view of earbud housing 2700 withcoaxial cable 2750 and conductive stopper 2760 installed in accordancewith an embodiment of the present invention. Coaxial cable 2750 cancouple to rigid section 2725 of circuit board 2720 using connector 2752,for example. Coaxial cable 2750 can be used to couple a processor inearbud housing 2700 with an antenna provided in a headset's primaryhousing (see e.g., antenna 1218 in primary housing 1210). Coaxial cable2750 can include, for example, an insulated wire surrounded by aconductive shield and an outer insulator. In some embodiments, the outerinsulator may be removed from at least a portion of cable 2750. Forexample, insulator can be removed to create exposed portion 2754 of thecable such that the insulator can be electrically coupled with (e.g.,grounded to) insert 2712. Insert 2712 can be grounded to neck 2710through the insert's threads and the neck can be grounded to a headset'sprimary housing (see e.g., housing 11 of FIG. 1). By grounding theinsulator of cable 2750, electromagnetic interference and other negativeeffects may be reduced thereby increasing the wireless performance of aheadset.

Conductive stopper 2760 can be installed in the lumen 2716 of insert2712. In some embodiments, conductive stopper 2760 can be made ofsilicone and filled with silver. Conductive stopper 2760 can include aslit for circuit board 2720 and coaxial cable 2750 to pass through lumen2716. Providing conductive stopper 2760 in neck 2710 can have severalbenefits. For example, conductive stopper 2760 can help isolate anysounds in acoustic volume 2796 from a headset's primary housing. In someembodiments, conductive stopper 2760 can also press exposed portion 2754of cable 2750 against the wall of insert 2712 such that the cable'sinsulator is always electrically coupled with (e.g., grounded to) theinsert. In other embodiments, stopper 2760 can be made from a conductivematerial such that the stopper can electrically coupled exposed portion2754 of the cable with insert 2712.

FIG. 28 shows a view of unassembled pieces of attachment system 2800that can be used to attach earbud housing 2820 to primary housing 2810in accordance with an embodiment of the present invention. Theconfiguration described below can allow for a mechanically robustconnection which prevents housing 2820 from rotating with respect toprimary housing 2810. An additional benefit of this design is the openlumen that can be used to run wires (or flexible printed circuit boards)between the earbud and primary housing. Attachment system 2800 can, forexample, correspond to device 600 of FIGS. 6A and 6B.

Attachment system 2800 can include insert 2840, earbud housing 2820,neck 2830, insert 2850 and primary housing 2810. In order to simplifymanufacturing, inserts 2840 and 2850 can be substantially similar andcan both include features 2841, (e.g., notches), threads 2842 and athrough-hole. Features 2841 can be arranged in a pattern to promoteproper interface with certain tools. A custom tool which can interfacewith inserts 2840 and 2850 is described in more detail in the discussionbelow corresponding to FIGS. 30A-30C.

Primary housing 2810 can include through-hole 2814. Insert 2850 can belocated in primary housing 2810 so that the threaded part of insert 2850protrudes through through-hole 2814. A through-hole can be providedthrough neck 2830, and the interior can be threaded so the neck cancouple with inserts 2850 and 2840. Earbud housing 2820 can include athrough-hole (see e.g., through-hole 612 of FIG. 6A) through whichinsert 2840 can pass to couple with neck 2830.

The top surface of neck 2830 can include one or more protrusions 2831(e.g., tabs) which can interface with one or more slots (e.g., notches)in the bottom of housing 2820 to prevent the two parts from rotatingindependently of each other when coupled together. The slots in thebottom of housing 2820 are not shown in FIG. 28, but slots similar toslots 2816 can be provided on the neck engaging surface of earbudhousing 2820 in accordance with an embodiment of the present invention.Earbud housing 2820 can have a curved exterior surface that can form anearly seamless transition with the curved exterior surface of neck2830.

The bottom surface of neck 2830 can include protrusions that interfacewith one or more slots 2816 in housing 2810 to prevent the two partsfrom rotating independently of each other when coupled together. Theprotrusions on the bottom surface of neck 2830 are not shown in FIG. 28,but protrusions similar to protrusions 2831 can be provided on thebottom surface of neck 2830 in accordance with an embodiment of thepresent invention. Primary housing 2810 can include recessed region 2818so that the bottom surface of neck 2830 can be recessed below theprimary exterior surface of the housing. Moreover, the exterior of neck2830 can be shaped to provide a nearly seamless transition from earbudhousing 2820 to primary housing 2810.

Neck 2830 and inserts 2840 and 2850 can be made from any suitablematerial (e.g., metals or polycarbonates). For example, neck 2830 can bemade from aluminum and inserts 2840 and 2850 can be made from steel. Thechoice of materials for neck 2830 and inserts 2840 and 2850 can dependon factors such as structural strength, weight, price, ability to bemachined, and cosmetic appearance.

FIG. 29 shows a flowchart of process 2900 for connecting a headsetearbud with a primary housing (e.g., a tube) in accordance with anembodiment of the present invention. Note that the protrusions and slotsof FIG. 28 are referred to, respectively, as tabs and notches in process2900. At step 2901, a bottom insert (such as insert 2850 of FIG. 28) canbe inserted into a primary housing. The bottom insert can be insertedfrom either side of the primary housing and manipulated so that thethreaded end is protruding from a through-hole in the wall of theprimary housing. At step 2902, thread-locking glue can be applied to thethreads of the bottom insert. The glue can be applied so that it coversa complete circular path around the threads of the insert.Alternatively, the glue can be applied to just one section of thethreads. The glue can be selected in order to prevent the insert fromunscrewing itself due to external forces (e.g., vibration). In oneembodiment, a sufficient quantity of glue may be applied to the threadsof the insert to prevent moisture and other harmful elements fromentering the inside of a headset through a seam which may exist betweenthe neck and the primary housing. At step 2903, a neck (such as neck2830 of FIG. 28) can be screwed onto the insert to a predeterminedlevel. At step 2904, the neck can be aligned to the primary housing sothat one or more tabs (e.g., protrusions 2831) on the neck fit withinone or more notches on the primary housing. At step 2905, a custom toolcan be used to turn the bottom insert while the neck is rotationallyfixed to the primary housing. At step 2906, the bottom insert can betightened to a predetermined torque. This torque measurement can beestimated by hand or performed with a calibrated torque wrench. At step2907, an earbud housing can be mounted to the neck so that one or moretabs on the neck fit within one or more notches on the earbud housing.At step 2908, thread-locking glue can be applied to the top insertthreads. The glue used on the threads of the top insert can be the sameas the glue used on the threads of the bottom insert and can be appliedin a similar manner. At step 2909, the top insert can be screwed intothe neck. At step 2910, the top insert can be tightened to apredetermined torque.

FIGS. 30A and 30B show custom tool 3000 that can be used to manipulatean insert (e.g., insert 2840 or insert 2850) with respect to a neck(e.g., neck 2830) in accordance with an embodiment of the presentinvention. Tool 3000 can include two members 3010 and 3020 which can becoupled together by fastener 3030. Fastener 3030 can allow members 3010and 3020 to rotate (or pivot) independently around the faster.

Members 3010 and 3020 can include appendages 3011 and 3021 which can beused by a user to control tool 3000. Appendages 3011 and 3021 can be anergonomic size and shape. For example, appendages 3021 can be curved toaccommodate an average human hand. Appendages 3011 and 3021 can includeplastic covers 3012 and 3022 with ridges 3013 and 3023 such that a usercan easily grip the appendages with his/her hands. A spring 3040 can becoupled with appendages 3011 and 3021 such that the appendages arebiased to separate from each other.

Members 3010 and 3020 may control the movement of manipulators 3014 and3024, which can interface with a part, such as an insert. For example,when appendages 3011 and 3021 are squeezed together, manipulators 3014and 3024 may be forced apart. Manipulators 3014 and 3024 can includenarrow sections 3015 and 3025 and tips 3016 and 3026.

FIG. 30B shows a detailed view of the shape of tips 3016 and 3026 inaccordance with an embodiment of the present invention. Tips 3016 and3026 can include outward facing tabs 3017 and 3027 which can interfacewith features (see e.g., features 2841 of FIG. 28) of inserts in orderto manipulate (e.g., screw into place) the inserts. Tabs 3017 and 3027can form the outer surface of narrow sections 3015 and 3025.

FIG. 30C shows custom tool 3000 coupling neck 3090 with primary housing3092 in accordance with step 2905 of FIG. 29 according to an embodimentof the present invention. FIG. 30C illustrates how the narrow section ofthe manipulators can be of sufficient length so that tabs 3017 and 3027can interface with features on the insert (see e.g., features 2841 ofFIG. 28). Note that to preserve the structural strength of themanipulators, the narrow section may not be constructed to besubstantially longer than necessary.

Extruded tubes with internal features for securing elements are usefulfor electronic devices. For example, such tubes can be used as a primaryhousing (see e.g., housing 11 of FIG. 1) or an earbud housing (see e.g.,earbud 12 of FIG. 1). The following discussion describes differentprocesses for creating a tube having an internal wall, for example, forsupporting circuitry or electronic components. It will be understood,however that the processes and devices described can be used to createany suitable feature on the inner surface of a tubular structure.

FIG. 31 is a cross-sectional view of a tube having an internal wall 3104in accordance with an embodiment of the present invention. Tube 3100 hasa wall thickness 3102, and includes internal wall 3104 that extendsinward perpendicular from the elongated axis of the tube. Internal wall3104 has a thickness 3106 and a height 3108 (as measured from the outersurface of the tube). The discussion accompanying FIGS. 32-33, 34-36,37-28, 39-40, and 41-43 respectively relate to various methods forcreating tube 3100 in accordance with some embodiments of the presentinvention.

Known extrusion processes are unable to extrude tubes with internalfeatures such as an internal wall (e.g., internal wall 3104). Forexample, known extrusion processes involve forcing a molten materialthrough an aperture in order to create an object with a cross-sectionalshape that is similar to the shape of the aperture. This type of processis incapable of producing tubes with discreet internal features becausesuch a tube will have a cross-sectional shape that varies along thelength of the tube. To overcome this limitation, existing processesrequire manufacturing a tube having a wall thickness equal to therequired height of the feature (e.g., height 3108), and subsequentlyremoving excess material around the feature using a machining process sothat the final wall thickness meets the desired specification (e.g.,thickness 3102). FIG. 32 is a cross section of an illustrative tubemanufactured with a wall thickness that is thicker than the desired endproduct wall thickness in accordance with an embodiment of the presentinvention. Tube 3200 may be formed from any material (e.g., metal,plastic, or composite) using any suitable process (e.g., extrusion,impact extrusion, or progressive deep draw). Wall thickness 3202 may beselected based on the features that will be carved into tube 3200.

FIG. 33 is a perspective view of a cross section of the illustrativetube of FIG. 32 once the tube has been machined to include an internalwall in accordance with an embodiment of the present invention. To forminternal wall 3204 in tube 3200, the entire inner surface 3201 of tube3200 is machined to remove excess material around the internal wall andto reduce tube thickness 3202 to a desired wall thickness. Thismachining step may be time consuming, expensive, and difficult toimplement, as it requires an experienced machinist and expensive tools.Furthermore, machining may also leave marks on the part, which may beundesired (e.g., for aesthetic reasons). Also, some features may includegeometry or aspects that cannot be manufactured by machining (e.g.,sharp angles not directly accessible from either end of the tube) orfeatures that cannot be manufactured within the required tolerances(e.g., due to the inherent size of the machining tools).

To overcome the limitations of an entirely machined tube, a number ofapproaches may be used. FIG. 34 is an illustrative die and stamper formodifying the internal aspect of a tube in accordance with an embodimentof the present invention. Tube 3400 is extruded with the desired finalthickness 3402 required for the tube. Tube 3400 is extruded to aslightly longer length 3403 than required for the final product, as thelonger portion may be part of a cold-worked process that is used tocreate the internal wall. A die 3410 may be inserted in a first end oftube 3400 and inserted such that die end 3412 is aligned with a desiredlocation of internal wall 3404 (see FIG. 36). Die 3410 may fit flushagainst the inside wall of tube 3400 and may be operative to maintainwall thickness 3402 when stamper 3420 is used to cold-work the tubingnot in contact with die 3410. Stamper 3420 is then inserted into thesecond end of tube 3400, and a stamping force is applied to cold workthe portion of tube 3400 located between the second end and die 3410.Stamper 3420 causes the wall thickness 3422 of tube 3400 to increase inthe cold worked portion of tube 3400 by forcing the excess tube lengthto be cold-worked into the internal wall. The shape of stamper 3420 andthe distance between the second end of tube 3400 and die end 3412 may beset to obtain the desired thickness for internal wall 3404.

FIG. 35 is an cross-sectional view of the tube of FIG. 34 after stamper3420 and die 3410 are removed from tube 3400 in accordance with anembodiment of the present invention. After stamping, tube 3400 includestwo thicknesses, thickness 3402 which is the expected final thickness ofthe tube, and thickness 3422, which corresponds a maximum possibleheight of any internal wall that may be machined from the thickerportion.

To create internal wall 3404, portions of inner surface 3401 of tube3400 may be machined. FIG. 36 is a perspective view of the tube of FIG.35 when the tube is machined to create an internal wall in accordancewith an embodiment of the present invention. The portions of innersurface 3401 having thickness 3422 may be machined to thickness 3402such that internal wall 3404 remains in tube 3400. Surface 3430 of FIG.36 can identify the surfaces that are machined to complete tube 3400. Anadvantage of this process over the process described in FIGS. 32 and 33is that the amount of machining required for the tube can be greatlyreduced, as are costs.

Another approach for forming features in a tube may include impactextrusion of one end of the tube. FIG. 37 is a cross section of anillustrative tube formed using impact extrusion in accordance with anembodiment of the present invention. Tube 3700 having wall thickness3702 is formed using impact extrusion. Impact extrusion creates anindentation that extends to surface 3710, which corresponds to thesurface of internal wall 3704 (FIG. 38) of tube 3700. The end of tube3700 remains closed by material 3722.

To complete tube 3700 and construct internal wall 3704, material 3722may be machined. FIG. 38 is a perspective view of the tube of FIG. 37when tube 3700 is machined to create an internal wall in accordance withan embodiment of the present invention. Material 3722 may be machined toleave inner surface 3701 of tube 3700 with thickness 3702, and withinternal wall 3704 extending from inner surface 3701. Surface 3730 mayrepresent the surface that is machined to create wall 3704. Similar tothe process of FIGS. 34-36, this process is advantageous over theprocess described in FIGS. 32-33 because the amount of machiningrequired for the tube can be greatly reduced.

Another approach for forming features in a tube may include impactextrusion of both ends of a tube. FIG. 39 is a cross section of anillustrative tube 3900 formed using impact extrusion in accordance withan embodiment of the present invention. Tube 3900 having final wallthickness 3902 is formed using multiple impact extrusions. The impactextrusions create a first indentation 3910 that extends to surface 3912with surrounding interior surface 3901 and a second indentation 3914that extends to surface 3916 with surrounding interior surface 3921. Thethickness of tube 3900 left by first indentation 3910 is thickness 3902,which may be the expected final thickness of the tube. The thickness oftube 3900 left by second indentation 3914 is thickness 3922. Thedifference between thickness 3902 and thickness 3922 may correspond toheight 3908 of internal wall 3904.

In some embodiments, if internal wall 3904 is configured to beconstrained between surfaces 3912 and 3916, the distance betweensurfaces 3912 and 3916 may correspond to the thickness 3906 of internalwall 3904.

In embodiments where internal wall 3904 is constrained between surfaces3912 and 3916, thickness 3922 may be the same as thickness 3902 (i.e.,substantially the expected final thickness of tube 3900) becauseinternal wall 3904 having height 3908 (as shown in FIG. 40) may bemachined from the material left between surfaces 3912 and 3916. In suchembodiments, height 3908 of internal wall 3904 may be determined by themachining process.

To complete tube 3900 and construct internal wall 3904, material betweensurface 3912 and 3916 may be machined. Material may also be machinedfrom interior surface 3921. FIG. 40 is a perspective view of the tube ofFIG. 39 once the tube is machined to create an internal wall inaccordance with an embodiment of the present invention. In someembodiments, material may be machined to leave interior surface 3921with thickness 3902, and with internal wall 3904 extending from interiorsurfaces 3901 and/or 3921. Surface 3930 of FIG. 40 identifies thesurface that may be machined to complete tube 3900. Similar to theprocesses of FIGS. 34-36 and 37-38, this process is advantageous overthe process described in FIGS. 32-33 because the amount of machiningrequired for the tube can be greatly reduced.

Yet another approach for forming features in a tube may include aprogressive deep draw process. FIG. 41 is a cross section of anillustrative tube formed using a progressive deep draw process inaccordance with an embodiment of the present invention. Tube 4100 isconstructed to have two consecutive indentations 4110 and 4114 havingdistinct wall thicknesses. Indentation 4110 has wall thickness 4102,which may be the expected final thickness of tube 4100, and indentation4114 has wall thickness 4122. Tube 4100 may transition from indentation4110 to indentation 4114 at plane 4112, which may correspond to thelocation of internal wall 4104 (FIG. 43) configured to be constructed ininner surface 4101 (FIG. 43) of tube 4100.

FIG. 42 is a perspective view of a cross section of the tube of FIG. 41in accordance with an embodiment of the present invention. As shown inFIG. 42, tube 4100 is closed at the end of indentation 4114 by material4124. To complete tube 4100 and construct internal wall 4104, material4124 may be machined to open tube 4100, and indentation 4114 may bemachined to reduce thickness 4122 to the thickness 4102 (e.g., the finalexpected thickness) while leaving internal wall 4104.

FIG. 43 is a perspective view of the tube of FIGS. 41 and 42 after thetube is machined to create an internal wall in accordance with anembodiment of the present invention. Surface 4130 of FIG. 43 identifiesthe surfaces that are machined to complete tube 4100. Similarly to theprocess of FIGS. 34-36, this process is advantageous over the processdescribed in FIGS. 32-33 because the amount of machining required forthe tube can be greatly reduced.

The following flow charts illustrate methods for forming a tube with afeature on the internal surface of the tube using embodiments of theinvention described above. Internal features may include, for example, awall, a protrusion, an aperture, a snap, a shelf, or any other suitablefeature. FIG. 44 is a flow chart of an illustrative process for formingan extruded tube with a feature on the internal surface of the tubeusing a die and stamper in accordance with an embodiment of the presentinvention. Process 4400 begins at step 4410. At step 4410, a tube isextruded and cut to a length that is slightly longer than the desiredfinished length. At step 4420, a die is inserted in one end of the tube,such that the end of the die placed in the tube extends to a desiredlocation where the feature is intended to exist in the tube.

At step 4430, a stamper is inserted in the second end of the tube. Atstep 4440, a force is applied to the stamper to force excess materialinto the tube, thus cold working the tube to increase the thickness ofthe tube in the region adjacent the stamper. At step 4450, the tube ismachined to form the feature. Process 4400 then ends at step 4450.

FIG. 45 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a single impactextrusion in accordance with an embodiment of the present invention.Process 4500 begins at step 4510. At step 4510, an indentation is formedin the material of the tube by impact extrusion such that the end of theindentation aligns with a desired location of the feature in the tube.At step 4520, the closed end of the material is machined to form thetube and the feature. Process 4500 then ends a step 4520.

FIG. 46 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a impactextrusion on both ends of the tube in accordance with an embodiment ofthe present invention. Process 4600 begins at step 4610. At step 4610, afirst indentation is formed in the material of the tube using a firstimpact extrusion. At step 4620, a second indentation opposing the firstindentation is formed in the material using a second impact extrusion.The ends of the first and second indentations may be configured to alignwith the boundaries of the feature. At step 4630, the feature ismachined in the material remaining between the first and secondindentations. Process 4600 then ends at step 4630.

In an alternative embodiment of the present invention, steps 4610 and4620 can be combined into one step, as indicated by the dotted linearound steps 4610 and 4620 in FIG. 46. That is, the first and secondindentations can be formed using a single impact. Advantageously, thiscan be more efficient than forming first and second indentations fromtwo impacts.

FIG. 47 is a flow chart of an illustrative process for forming a tubewith a feature on the internal surface of the tube using a progressivedeep draw process in accordance with an embodiment of the presentinvention. Process 4700 begins at step 4710. At step 4710, first andsecond indentations are formed consecutively using a progressive deepdraw process. The interface between the first and second indentationsmay be configured such that the feature is located at the interface. Atstep 4720, the material closing the tube (i.e., not removed by theprogressive deep draw process) is removed. At step 4730, the feature ismachined in the inner surface of the tube. Process 4700 then ends atstep 4730.

It is understood that any of the processes described above in connectionwith providing a wall in the inner surfaces of a tube may be used toform any other suitable feature on the inner surface of a tube. Inaddition, it is understood that these processes may be used fornon-extruded and non-tubular components. It is also understood that anyof the processes described above can be applied to a component formedfrom injection molded plastic or any other material.

In order to convey information, such as device status, visual indicatorsystems can be included in a headset. One type of indicator system canemit different colors of light to indicate what a device is doing. Forexample, a system in a headset can emit a green light if it is in atelephone conversation and a blinking red light if the battery power islow.

FIG. 48 shows a simplified cross-sectional view of a visual indicatorsystem 4800 for a headset in accordance with an embodiment of thepresent invention. Visual indicator system 4800 can, for example,correspond to display system 18 of FIG. 1, system 700 of FIG. 7, ordisplay 1013 of FIG. 10B. One or more light sources 4821 and 4822 can beintegrated into system 4800. Light sources 4821 and 4822 can be, forexample, LEDs that each emit a different color of light. Each color orcombination of colors can be used to signify different information(e.g., the mode of a headset or a function the headset is performing).Light sources 4821 and 4822 can be mounted onto circuit board 4820.Through circuit board 4820, the light sources can be electricallycoupled with driver circuitry (see e.g., LED driver 1424 of FIG. 14)that is operable to activate each source individually or in combination.A detailed description of circuitry with this functionality can be foundin U.S. Patent Application No. 60/878,852 entitled “Systems and Methodsfor Compact Multi-State Switch Networks,” which is incorporated herein.

It is understood that, while the embodiment shown in FIG. 48 uses twoseparate light sources (e.g., light sources 4821 and 4822), any numberof light sources can be provided without deviating from the spirit andscope of the present invention. In some embodiments, a single lightsource device can be provided that includes two LEDs such that thedevice can emit light from either of the LEDs or a combination of thetwo LEDs. For example, a light source device can be provided thatincludes a green LED and a red LED. Such a light source device may, forexample, emit green light when activating only the green LED, red lightwhen activating only the red LED, and amber light when activating bothLEDs in combination.

Microperforations 4812 can be provided in housing 4810 so that lightsources 4821 and 4822 are visible to a user. Outer apertures 4814 ofmicroperforations can have a small diameter so that they areimperceptible to a user when light sources 4821 and 4822 are off. Thediameter of inner apertures 4816 can be of a larger size so that theycan guide more light through the microperforations. A detaileddescription of microperforations and their fabrication can be found inU.S. patent application Ser. Nos. 11/456,833 and 11/551,988 which areboth entitled “Invisible, Light-Transmissive Display System,” and whichare both incorporated herein. For the purposes of illustration, onlyfive microperforations are shown in FIG. 48, however a much largernumber of microperforations can be used without deviating from thespirit of the present invention. It is further understood that none ofthe elements of FIG. 48, including microperforations 4812, are drawn toscale.

While the incorporated U.S. patent application Ser. Nos. 11/456,833 and11/551,988, both entitled “Invisible, Light-Transmissive DisplaySystem,” describe microperforations for use with display systems,microperforations can also be used as acoustic ports in accordance withthe present invention. For example, one or more microperforations can beprovided such that acoustic pressure can pass through themicroperforations and exit a volume. For example, acoustic ports 1021and 1022 of FIGS. 10A and 10B may be composed of a plurality ofmicroperforations in earbud 1020.

Light diffuser 4830 can be located between circuit board 4820 and aninner wall of housing 4810. Light diffuser 4830 can, for example, bemade of a polycarbonate with sections of varying opacity. Outer core4832 of diffuser 4830 can be made from a substantially opaque materialsuch that light from light sources 4821 cannot pass through the core.Outer core 4832 can be substantially opaque in that it can transmit 0%to 20% of light. For example, if outer core 4832 is substantially opaqueit can deflect light back into inner core 4834 such that the lightdoesn't exit the sides of the diffuser.

Inner core 4834 can be located within the inner wall of outer core 4832.The inner core 4834 of diffuser 4830 can be made from, for example, acombination of substantially transparent or translucent substrate 4835and diffusing particles 4836 such that the particles are suspended inthe substrate. In some embodiments, substrate 4835 can be substantiallytransparent in that it can transmit 80% to 100% of light. In otherembodiments, substrate 4835 can be translucent such that it transmitsany of 0% to 100% of light. Both substrate 4835 and particles 4836 canbe, for example, made from polycarbonate materials of differentopacities. Particles 4836 can be made from an opaque or translucentmaterial that alters the path of light through inner core 4834.Particles 4836 can have any form (e.g., a sphere, a cylinder, a cube, aprism, or an uneven form). In some embodiments, each of particles 4836can have a different form to simplify manufacturing. The combination ofsubstrate 4835 and particles 4836 can thoroughly diffuse light from thelight sources when it exits the top of inner core 4834. That is, thelight from light sources 4821 and 4822 can be evenly spread across thetop surface of inner core 4834 so that a user detects an even intensityof light exiting microperforations 4812.

It is understood that other diffusion means can be used withoutdeviating from the spirit and scope of the present invention. Forexample, surface textures, coatings or labels can be applied to a lighttransmissive material such that any light passing through the materialis substantially diffused.

Inner core 4834 can have a sufficient width 4890 so that it surroundsthe footprint of light sources 4821 and 4822. In one embodiment, innercore width 4890 can be approximately 1.7 millimeters (e.g., between 1.5millimeters and 1.9 millimeters), and the width 4892 of outer core 4832can be approximately 2.8 millimeters (e.g., between 2.6 millimeters and3.0 millimeters). In some embodiments, the width of the end of thediffuser proximal to circuit board 4820 can be different from the widthof the end of the diffuser proximal to housing 4810. For example,diffuser 4830 can be in shape similar to a cone such that the width ofthe end of the diffuser proximal to housing 4810 is smaller than thewidth of the diffuser proximal to circuit board 4820. In other words,diffuser 4830 can, for example, be in the shape of a cone having aflattened top.

The bottom surface of outer core 4832 can extend below the bottomsurface of inner core 4834 so that the outer core can be mounted tocircuit board 4820 without the inner core damaging light sources 4821and 4822. The outer core 4832 can be attached to circuit board 4820using, for example, an adhesive or any other suitable material.

In FIG. 48, light source 4822 is activated and emitting light 4860.Because of the effect of light diffuser 4830, light 4862 can be evenlydistributed as it exits the diffuser, thereby making it difficult for aperson to discern whether the light is being generated by light source4821 or light source 4822.

FIG. 49 shows the exterior of an embodiment of headset 4910 thatincludes visual indicator 4913 in accordance with an embodiment of thepresent invention. Headset 4910 may correspond to headset 10 of FIG. 1,for example. The embodiment shown in FIG. 49 uses LEDs 4921 and 4922 aslight sources and includes a cylindrical light diffuser. Visualindicator 4913 can include microperforations 4912 which allow a user tosee light being emitted from LEDs 4921 and 4922. A light diffuser can beincluded between the LEDs and microperforations 4912 so that thediffused light seen by a user is equally distributed over themicroperforations. The diameter 4990 of the microperforated area can besubstantially similar to or smaller than the diameter of the diffuser'sinner core. Diameter 4990 can be, for example, approximately 1.7millimeters (e.g., between 1.5 millimeters and 1.9 millimeters).

Alternatively, the size and shape of the microperforated area could bedifferent from that of the light diffuser. For example, amicroperforated area with a noncircular shape can be placed over a lightdiffuser so that a noncircular indicator is generated. Similarly, theshape of the light diffuser can be non-cylindrical. Moreover, the lightdiffuser can be larger than the microperforated area so that it cancover the footprint of any other light sources that might be included.

Numerous light sources of different colors can be used in conjunctionwith a light diffuser as described above in order to present a visualindicator to a user. Because of the effect of the material in the lightdiffuser, light from each different source may appear evenly distributedover an area. In this manner, the entire indicator can appear to changecolors as different light sources are activated.

FIG. 50A includes a side view of headset 5000 in accordance with anembodiment of the present invention. Connector 5040 can include primaryhousing 5010, connector plate 5041, contacts 5043, casing 5044 andmicrophone port 5050. Connector plate 5041 can include recessed groove5042 which runs around the perimeter of connector plate 5041. Groove5042 can also be referred to as a recessed step in connector plate 5041.At the top of connector plate 5041, a microphone port 5050 can belocated in groove 5042.

There are many benefits associated with placing microphone port 5050along the edge of connector plate 5041. By including the microphone portnear the connector plate, the microphone can be embedded in theconnector which saves space inside the headset housing. The space thatis saved can be used to incorporate other functionality or decrease theoverall size of the headset. Moreover, locating the microphone port inthe groove around the edge of the connector can hide it from view whichincreases the overall aesthetic appearance of the headset

FIG. 50B shows a detailed view of the microphone port area of aconnector in accordance with an embodiment of the present invention. Thedimensions of port 5050 can include, for example, a width 5090 ofapproximately 2.5 millimeters and a height 5092 of approximately 0.3millimeters. These dimensions are merely illustrative and it isunderstood that other dimensions may be practiced.

FIG. 51 shows a view of connector 5140 with the primary housing removedin accordance with an embodiment of the present invention. Connector5140 can, for example, correspond to connector 16 of FIG. 1, assembly320 of FIG. 3, assembly 420 of FIG. 4, connector 1040 of FIG. 10A, orconnector 1140 of FIG. 11. Connector 5140 can be mounted up primaryhousing circuit board 5115, for example. Connector 5140 can includeconnector plate 5141, contacts 5143 and accompanying casing 5144 toprevent the contacts from electrically coupling with the connectorplate. Microphone port 5150 can be included in the top of connectorplate 5141 to allow sound to reach microphone boot 5120. Microphone boot5120 and a microphone contained therein can be located behind connectorplate 5141. The microphone can be contained within microphone boot 5120to, for example, protect the microphone from damage and control the flowof air into the microphone.

FIG. 52 shows an exploded view of connector 5140 of FIG. 51 which caninclude, for example, connector plate 5240, microphone boot 5220,microphone 5222, contacts 5243, casing 5244, bracket 5248 and screws5249 in accordance with an embodiment of the present invention.Microphone 5222 can be a MEMs microphone and can be electrically coupledwith circuit board 5215. Circuit board 5215 is similar to primaryhousing circuit board 1115 of FIG. 11. Microphone boot 5220 can mountover microphone 5222. Microphone boot 5220 can, for example, be made ofsilicon so that it can seal with surrounding parts when connector 5200is assembled. Contacts 5243 can be included in casing 5244. Casing 5244can be made of a non-conductive material (e.g., polymeric) so thatcontacts can not be electrically coupled with connector plate 5240.Casing 5244 can be mounted onto circuit board 5215 and includeconductive elements (see e.g., shank 5707 and contact segment 5708 ofFIG. 57B) which can electrically couple contacts 5243 with circuit board5215. Bracket 5248 can couple with connector plate 5240 in order to holdconnector 5200 together. Upward pressure from bracket 5248 can compressmicrophone boot in order to create an acoustic (e.g., substantiallyair-tight) seal for the passage of air into and out of microphone 5222.Circuit board 5215, casing 5244 and bracket 5248 can include one or moreapertures for mounting to connector plate 5240. Screws 5249 can beinserted through these apertures and screwed into threaded cavities (seee.g., cavities 6046) on the back of connector plate 5240.

FIG. 53 shows a view of microphone boot 5320 which can include inputaperture 5325 in accordance with an embodiment of the present invention.Microphone boot 5320 can, for example, correspond to microphone boot5220 of FIG. 52. Air that flows into a headset by going aroundmicrophone boot 5320 can cause a noticeable loss in the quality of theaudio signals picked up by a microphone in the boot. Therefore,microphone boot 5320 can include sealing surface 5326 to prevent airfrom leaking through any seams along the edge of the microphone boot.Sealing surface 5326 can be a horizontal surface of boot 5320 thatextends to the perimeter of the boot's footprint. Sealing seams in thismanner can direct the flow of air into aperture 5325 which can result inhigher sound quality being received by the microphone.

Traditionally, the roof of a microphone boot creates a seal with thesurfaces of surrounding parts. This can require a thicker roof which isstructurally robust enough to support the pressure required to make anadequate seal. Because boot 5320 uses horizontal sealing surface 5326(instead of roof 5327) to seal with surrounding parts, roof 5327 doesnot need to be very thick. This reduced thickness saves space in ahousing and can result in a generally smaller or thinner headset.

FIG. 54 shows a perspective, cross-sectional view of connector plate5440 which includes microphone boot 5420 and microphone 5422 inaccordance with an embodiment of the present invention. Connector plate5440, boot 5420 and microphone 5422 can, respectively, correspond toconnector plate 5240, booth 5220 and microphone 5222 of FIG. 52, forexample. The components shown in FIG. 54 can fit together so that aircan pass through microphone port 5450, into boot aperture 5425 and reachmicrophone input 5421. Microphone port 5450 may, for example, be acut-out in the recessed step of connector plate 5440. Because of otherelements in the connector assembly (e.g., circuit board 5215 and bracket5248), microphone 5422 and microphone boot 5420 can be pushed up againstconnector plate 5440 when installed in a headset. The pressure from thisforce can cause surface 5426 to form a seal with surface 5445 ofconnector plate 5440. This seal can prevent air from passing throughseam 5490 in between connector plate 5440 and microphone boot 5420.

In some embodiments, porous plug 5428 may be provided in boot aperture5425. Plug 5428 may be, for example, made from a porous foam (e.g.,sintered polyethylene or super high-density polyethylene). Plug 5428 canhelp filter out high-frequency noises such as those generated by windblowing into microphone port 5450. The acoustical performance of plug5428 can be a factor of its porosity which can be controlled bymanufacturing. For example, plug 5428 can be manufactured by meltingparticles of polyethylene together. The porosity of the resulting plugcan be a function of how long the particles are melted, what temperatureis used to melt the particles, and the particles size. In someembodiments, it may be advantageous to only use polyethylene particlesof a certain size when forming plug 5428. For example, particles with adiameter between 177 microns and 250 microns may be melted to form plug5428.

FIGS. 55A and 55B show views of the connector of headset 5500 inaccordance with an embodiment of the present invention. Four contacts5561, 5562, 5563 and 5564 can be integrated into the connector. Thecontacts can be of a substantially flat shape so that they are flushwith the face of connector plate 5540. The contacts can, for example, beof an oval shape. The outer contacts 5561 and 5564 can be configured forcoupling to either a power supply line or a ground line. The remaininginner contacts 5562 and 5563 can be configured for receiving andtransmitting data.

Connector plate 5540 can be located within primary housing 5510 and caninclude recessed groove 5542. Height 5580 of primary housing 5510 can beapproximately 5 millimeters or can be from a range between 4.7 and 5.3millimeters. Height 5581 of the interior cavity of primary housing 5510can be approximately 4 millimeters or can be from a range between 3.7and 4.3 millimeters. Height 5582 of the raised face of connector plate5540 can be approximately 3.3 millimeters or can be from a range between3.0 and 3.6 millimeters. Heights 5580, 5581 and 5582 can be advantageousbecause they can provide a headset having a small form-factor yet largeenough to adequately couple with a complementary connector. Heights 5581and 5582 can also provide an adequate groove for sound from a user'svoice to reach a microphone embedded in connector plate 5540 (see e.g.,microphone 17 of FIG. 1). It is understood that these dimensions aremerely illustrative. It is also understood that connector plate 5540 andthe aperture in primary housing 5510 are angled with respect to the axisof primary housing 5510, and heights 5580, 5581 and 5582 reference theorthogonal heights of the corresponding elements.

Connector plate 5540 can include four contacts 5561, 5562, 5563 and 5564which can be separated by pitch 5583, which can be approximately 2millimeters or from a range between 1.75 and 2.25 millimeters. Pitch canbe defined as the distance from the centerline of a contact to thecenterline of the nearest contact. Pitch 5583 can be advantageousbecause it can allow contacts on complementary connectors (see e.g.,connector 6200 of FIG. 62A and 62B) to be sufficiently spaced apart suchthat magnetic components can be provided between the contacts.

Each contact can have a width 5584, which can be approximately 0.7millimeters or from a range between 0.5 and 0.9 millimeters. The ring ofexposed casing can have a width 5586 of approximately 0.2 millimeters orcan be from a range between 0.12 and 0.3 millimeters. All of the ringsof exposed casing can have the same width (e.g., width 5586). Width 5586can be advantageous because it is large enough to prevent contacts 5561,5562, 5563 and 5564 from shorting with connector plate 5540, but smallenough to not impact the size of connector plate 5540. The contacts canbe arranged on the face of connector plate 5540 so that they aresymmetrical about the centerline of headset 5500. Dimension 5585, whichrepresents the distance from the centerline of each contact to thecenterline of the headset, can be approximately 1 millimeter. Thedimensions of contacts 5561-5564 can be advantageous because thedimensions can provide a sufficient surface for coupling with acorresponding connector while maintaining a small form-factor headset.For example, if the contacts were much larger, the size of housing 5510may need to increase.

FIG. 55D includes a side view of headset 5500 in accordance with anembodiment of the present invention. The angle between the face ofconnector plate 5540 and the axis of primary housing 5510 can berepresented by angle 5587, which can be approximately 55 degrees or froma range between 10 and 80 degrees. Angle 5587 can be advantageousbecause it can provide a suitable angle for mating headset 5500 with acorresponding connector. Angle 5587 may also provide an appropriateangle for reflecting sound from a user's mouth to the microphone ofheadset 5500 (see e.g., microphone 17 of FIG. 1). Angle 5587 can also beprovided to block outside sounds from the microphone of headset 5500.

As measured along the surface of connector plate 5540, the height 5588of each contact can be approximately 1.5 millimeters. Height 5588 can beadvantageous because it provides a substantial surface area for headset5500 to couple with corresponding connectors but does not necessarilycause an increase in the size of housing 5510.

The connector plate 5540 can be recessed in primary housing 5510 by adepth 5589 of approximately 0.25 to 0.3 millimeters. This depth can bedetermined by measuring the distance between the face of connector plate5540 and a plane defined by the end of primary housing 5510 (e.g., aplane including three points on the connector end of primary housing5510). Depth 5589 can be advantageous because it can provide asufficient depth to strengthen the mechanical link between headset 5500and a corresponding connector, but not be of such a large depth that itbecomes difficult to align the headset with such a connector.

FIG. 55C includes a top view of headset 5500 in accordance with anembodiment of the present invention. Width 5590 of primary housing 5510can be approximately 12.3 millimeters or can be from a range between 10and 14 millimeters. Width 5591 of the interior cavity of primary housing5510 can be approximately 11.1 millimeters or can be from a rangebetween 7 and 13 millimeters. Width 5592 of the raised face of connectorplate 5540 can be approximately 10.3 millimeters or can be from a rangebetween 5 and 11 millimeters. Widths 5590, 5591, and 5592 can beadvantageous because they can provide a large enough area for headset5500 to securely couple with a complementary connector, while not beingso large so as to prevent headset 5500 from having a small form-factor.The dimensions given above apply to the embodiments shown in 55A, 55B,55C and 55D and it is understood that other dimensions can be usedwithout deviating from the scope of the present invention.

FIG. 56 illustrates an assembly of electrical contacts for connector1040 in accordance with an embodiment of the present invention. Assembly5601 can include plurality of electrical contacts 5602 disposed innon-conductive (e.g., polymeric) casing 5603. Casing 5603 can includeprotruding members such that each protruding member can extend through acavity in a connector plate. In FIG. 52, for example, casing 5244includes four protruding members and connector plate 5240 includes fourcavities (or apertures). When casing 5244 is coupled with connectorplate 5240, the casing's protruding members will fill those cavities.Accordingly, each protruding member can be referred to as a protrudingcavity member as well. Electrical contacts 5602 can extend through atleast a portion of depth 5690. In an assembled headset, each electricalcontact 5602 can have a portion disposed in electrical contact withelectrical contact 5604 of circuit board 5605, which can be flexible orrigid.

FIGS. 57A and 57B illustrate an assembly of electrical contacts inaccordance with one embodiment of the present invention. Assembly 5701can include plurality of electrical contacts 5702 disposed innon-conductive casing 5703. Each electrical contact 5702 can have firstportion 5705 and second portion 5704, each of which are manufacturedindependently and assembled together thereafter.

First portion 5705 can have head 5706 and shank 5707. Head 5706 can havean exposed surface for engagement with an external electrical contactof, for example, a connector on a charging dock or cable. In oneembodiment of the present invention, the exposed surface on head 5706can have a conductive, durable finish that also is aestheticallyappealing, for example, nickel, tin cobalt, or a blackened finish. Shank5707 can be integrally formed with head 5706 or formed independently andthen attached to head 5706 using adhesive material (e.g., glue, solder,weld, surface mount adhesion material, etc.). For example, duringmanufacturing, first portion 5705 can be formed from a cylindrical blockof conductive material, turned to create shank 5707, and stamped ormilled to shape head 5706, for example, into an oval shape.

Second portion 5704 can have engagement segment 5709 and contact segment5708. Engagement segment 5709 can have a hole configured for acceptingshank 5707 of first portion 5705 during assembly of electrical contact5702 to casing 5703. Conductive adhesive material can be applied duringmanufacturing to mechanically and electrically couple first portion 5705and second portion 5704 of electrical contact 5702. Contact segment 5708can have an internal surface for engagement with electrical contact 5604on circuit board 5605 (see FIG. 56) when in an assembled headset. Theengagement surface of contact segment 5708 also can have a finish (e.g.,gold-plating) that has good properties for adhering electrical contact5702 to circuit board 5605, storage, and corrosion-resistance.

In one embodiment of the present invention, the center of the internalcontact surface of second portion 5704 can be offset from the center ofthe external surface of first portion 5705 when considered in a planesubstantially defined by the external contact surface of first portion5705. This can be useful when design constraints require electricalcontacts 5702 to electrically couple electronic components that are notco-linearly aligned, as in one embodiment of the present inventionillustrated in FIG. 56. In one embodiment of the present invention,second portion 5704 can have a hook-shape to position the internalcontact surface of second portion 5704 in an offset configuration withrespect to shank 5707. In manufacturing, second portion 5704 can bestamped from sheet metal, machined from a solid block of conductivematerial, molded, or formed using a different method known in the art orotherwise. In one embodiment of the present invention, second portion5704 can be stamped from sheet metal in high volume productionsituations to save valuable time and money.

FIGS. 58A-58C illustrate an assembly of electrical contacts inaccordance with another embodiment of the present invention. Assembly5801 can include plurality of electrical contacts 5802 disposed innon-conductive casing 5803. Similar to the embodiment illustrated inFIGS. 57A-57B, each electrical contact 5802 can have first portion 5805and second portion 5804, each of which are manufactured independentlyand assembled together thereafter.

First portion 5805 can have an exposed surface for engagement with anexternal electrical contact of, for example, a connector on a chargingdock or cable. In one embodiment of the present invention, the exposedsurface on first portion 5805 can have a conductive, durable finish thatalso is aesthetically appealing.

Second portion 5804 can have engagement segment 5806, shank 5807, andcontact segment 5808. Engagement segment 5806 can be electrically andmechanically coupled to first portion 5805 using, for example, surfacemount technology, solder, weld, or another conductive adhesive. Shank5807 can couple engagement segment 5806 to contact segment 5808. Contactsegment 5808 can have an internal surface for engagement with electricalcontact 5604 on circuit board 5605 (see FIG. 56) when headset assembly5801 is installed in a headset (e.g., headset 10 of FIG. 1). Theengagement surface of contact segment 5808 also can have a finish thathas good properties for soldering, storage, and corrosion-resistance.

In one embodiment of the present invention, the center of the internalcontact surface of contact segment 5808 can be offset from the center ofthe external surface of first portion 5805 when considered in a planesubstantially defined by the external contact surface of first portion5805. In one embodiment of the present invention, second portion 5804also can have a hook-shape to position the internal contact surface ofsecond portion 5804 in an offset configuration with respect to theexternal contact surface of first portion 5805.

FIG. 58C illustrates how assembly 5801 can be manufactured in accordancewith one embodiment of the present invention. Initially, second portions5804 of one or more electrical contacts 5802 can be stamped from singlepiece of sheet metal 5809 and folded into, e.g., a hook-shape asdescribed above. This can create fingers 5810 in sheet metal 5809 thatmechanically and electrically couple all electrical contacts 5802. Firstportions 5805, which also can be stamped in a separate operation, thencan be adhered to engagement segments 5806 of each second portion 5804.This assembly then can be placed in an injection molding machine toinjection-mold casing 5803 around the assembly. Once the injectionmolding procedure is complete, a blade can sever second portions 5804 ofelectrical contacts 5802 from the rest of sheet metal 5809, therebymechanically and electrically decoupling each electrical contact 5802from the other electrical contacts. Advantageously, because firstportions 5805 and second portions 5804 can be formed from a stampingprocess, assembly 5801 can be used in high volume production situationsby saving valuable time and money.

FIGS. 59A and 59B illustrate electrical contacts in accordance withfurther embodiments of the present invention. Electrical contacts 5901and 5905 can be similar to that described above with respect to FIGS.57A-58C, except that electrical contacts 5901 and 5905 can be formed asone unitary piece.

Electrical contact 5901 can have external contact portion 5902, shank5903, and internal contact portion 5904. External contact portion 5902can have an external surface for engagement with an external electricalcontact of, for example, a connector on a charging dock or cable. Shank5903 can couple external contact portion 5902 to internal contactportion 5904. Internal contact portion 5904 can have an internal surfacefor engagement with electrical contact 5604 on circuit board 5605 (seeFIG. 56) when electrical contact 5901 is installed in a headset (e.g.,headset 10 of FIG. 1). As in the above-described embodiments, the centerof the internal contact surface of internal contact portion 5904 can beoffset from the center of external contact portion 5902 when consideredin a plane substantially defined by the external contact surface ofexternal contact portion 5902. Electrical contact 5901 also can have ahook-shape to position the internal contact surface of internal contactportion 5904 in an offset configuration with respect to the center ofexternal contact portion 5902. In one embodiment of the presentinvention, electrical contact 5901 can be machined from a single blockof conductive material.

Similar to electrical contact 5901, electrical contact 5905 also canhave external contact portion 5906, shank 5907, and internal contactportion 5908. Rather than being machined from a conductive material,however, electrical contact 5905 can be stamped from sheet metal andfolded to form the hook-shape. Again, because the electrical contact canbe manufactured using a stamping procedure, it can be used in highvolume production situations.

FIGS. 60A and 60B show two views of connector plate 6040 of a headsetconnector in accordance with an embodiment of the present invention.Recessed step 6042 can run around the edge of connector plate 6040 inorder to create a groove when the plate is installed in a primaryhousing (see e.g., primary housing 1110 of FIG. 11). Microphone port6050 can be cut out of step 6042 in order to create an opening for soundto reach cavity 6051 where a microphone or microphone boot (see e.g.,microphone boot 5220) can be located. In FIG. 60B, surface 6045 ofconnector plate 6040 can be used to compress the perimeter of amicrophone boot so that an airtight seal is made.

Tabs 6047 and threaded cavities 6046 can be used to mount other elementsonto connector plate 6040. For example, tabs 6047 can mate with abracket that wraps around the entire connector assembly (see e.g.,bracket 5248 of FIG. 52). This same bracket can include apertures foruse in conjunction with threaded cavities 6046 so that inserts (e.g.,screws) can fix the bracket against connector plate 6040. Bracket 5248of FIG. 52 is an example of a bracket that is suitable for use withconnector plate 6040.

In accordance with one aspect of the present invention, connector plate6040 can be made of a material with magnetic properties. Byincorporating magnetic properties into connector plate 6040, magneticeffects can be used to enhance the coupling between connector plate 6040and a complementary connector (see e.g., FIG. 62B). Connector plate 6040can include, for example, a ferromagnetic material such as a steelalloy. In another embodiment, connector plate 6040 can include apermanent rare-earth magnet that produces a magnetic field. Moreover, anembodiment of connector plate 6040 can include an electromagnet whichproduces a magnetic field as a result of the application of electriccurrent. In the electromagnetic embodiment, the magnetic field can becontrolled (e.g., through the application of an electric current) sothat it is only present when necessary. In the embodiments whereconnector plate 6040 includes a permanent magnet or an electromagnet, acomplementary connector (see e.g., FIG. 62B) can include a ferromagneticmaterial or a complementarily positioned permanent magnet orelectromagnet.

FIG. 61A shows array 6180 of magnetic components which can be embeddedin a connector in accordance with an embodiment of the presentinvention. Array 6180 can include components 6181, 6182, 6183, 6184 and6185 which can be made of, for example, a permanent rare-earth magneticmaterial. An example of a suitable material for magnetic components6181-6185 is magnetized Neodymium and, more specifically, N50 magnets.The magnetic components 6181-6185 can be shaped so that a substantiallyflat mating face 6186 is formed along one side. This mating face 6186can, for example, be at an angle complementary to the angle of aheadset's connector plate (see e.g., angle 5587 of FIG. 55D).

FIG. 61B shows a view of how connector plate 6140 can be used incombination with array 6180 of magnetic components in accordance with anembodiment of the present invention. If connector plate 6140 is made ofa ferromagnetic material and array 6180 includes permanent magnets, themagnetic fields of array 6180 will generate magnetic forces biasingconnector plate 6140 and array 6180 together. If array 6180 is embeddedwithin a connector that mates with connector plate 6140, these magneticforces can reinforce the connection.

In order to maximize the magnetic field generated by array 6180, it canbe advantageous to arrange components 6181-6185 (e.g., magnets) so thatthe polarity of each component is in a particular orientation. Forexample, the components can be arranged so that the south pole of theouter two magnets are closest to the mating face, and the north pole ofthe inner three magnets are closest to the mating face. In thisconfiguration, if one were to list the polarities encountered whenpassing horizontally over the mating face, the list would readsouth-north-north-north-south. This maximization of the magnetic fieldis one reason why it might be desirable to use an array of magnets asopposed to one large magnet.

While the embodiments described above include a ferromagnetic connectorplate and an array of permanent magnets embedded in a complementaryconnector (see e.g., FIG. 62B), it is contemplated that any othermagnetic configurations can be used without deviating from the spirit ofthe present invention. For example, an electromagnet element can beincluded in the connector plate and a ferromagnetic material can belocated in a complementary connector. A detailed discussion about theuse of electromagnetic and magnetic elements in connectors can be foundin U.S. patent application Ser. No. 11/235,873 entitled “ElectromagneticConnector for Electronic Device” and U.S. patent application Ser. No.and 11/235,875 entitled “Magnetic Connector for Electronic Device,”which are both incorporated herein.

FIGS. 62A and 62B show connector 6200 that is complementary to andcapable of mating with connector 1040 of FIG. 10A in accordance with anembodiment of the present invention. Connector 6200 can, for example,correspond to headset engaging connector 220 of FIG. 2. Connector 6200can be integrated into, for example, a charger (see e.g., dockingstation 6400 of FIG. 64, device 6600 of FIG. 66, and docking station6700 of FIG. 67B) which charges a battery in a headset or otherapparatus that facilitates the charging of the headset (such as anapparatus discussed in U.S. patent application Ser. No. 11/620,669entitled “Apparatuses and Methods that Facilitate the Transfer of Powerand Information Among Electrical Devices” which is incorporated herein).

The view of connector 6200 in FIG. 62A does not include connectorhousing 6210 so that magnetic array 6280 and contacts 6290, 6292, 6294and 6296 can be seen. Array 6280 can be installed in connector 6200 suchthat it forms a magnetic array structure, and each magnet of the arraycan be separated by a gap of predetermined size. Array 6280 of magneticcomponents can be embedded in connector housing 6210 so that the surfaceof components 6282, 6283 and 6284 can be flush with mating face 6286.These exposed components can extended all of the way to the surface of acorresponding connector plate so that the strongest magnetic forces aregenerated. However, a connector can have no exposed magnetic elementswithout deviating from the spirit of the present invention. For example,it can be desirable to recess magnetic components 6281 and 6285 in orderto create a smaller connector.

Contacts 6290, 6292, 6294 and 6296 can be included in connector 6200. Inorder to integrate the contacts with the array 6280 of magneticcomponents, each contact can be placed in the gaps between magneticcomponents. In this manner, contact 6290 can be located in betweenmagnetic components 6281 and 6282, contact 6292 can be located betweencomponents 6282 and 6283, etc. This integrated distribution of contactscan allow for a smaller connector. This is another example of a reasonwhy it might be desirable to use multiple magnetic components that arespaced apart as opposed to a single, large magnetic component.

Each contact can include a spring mechanism, such as coil 6297 ofcontact 6296. Coil 6297 can bias contact tip 6296 to extend out ofconnector housing 6210. The coils 6291, 6293, 6295 and 6297 included inthe contacts can be substantially planar or flat. A flat coil can allowfor minimal spacing between magnetic components 6281-6285. This reducedspacing can result in a generally smaller connector. However, othertypes of coils and contacts can be used in accordance with theprinciples of the present invention. For example, a cylindrical springbiasing a cylindrical contact, commonly called a “pogo pin,” can be usedwithout deviating from the spirit of the present invention.

Contacts 6290, 6292, 6294 and 6296 can be position to electricallycouple with, for example, the contacts located on the face of aconnector plate of a headset. Connector housing 6210 can include anelevated face 6212 which can, for example, fit into a cavity in acomplementary connector. For example, if connector 6200 were to matewith headset 1000 of FIGS. 10A and 10B, the elevated face 6212 can fitagainst recessed connector plate 1041 while the edge of primary housing1010 can fit against the recessed perimeter 6214 of connector 6200. Inthis mating configuration, contacts 6290, 6292, 6294 and 6296 can beelectrically coupled with contacts 1042 of headset 1000.

Connector 6200 can include contacts or wires (not shown) on the rear ofhousing 6210 so that the connector can be electrically coupled withother circuitry. For example, connector 6200 can be mounted onto acircuit board that includes power supply circuitry (such as circuitrydiscussed in U.S. patent application Ser. No. 11/620,669 entitled“Apparatuses and Methods that Facilitate the Transfer of Power andInformation Among Electrical Devices” which is incorporated herein) thatcan be used to transmit power to a headset through one or more contacts.

FIGS. 63A and 63B show connector 6300 that is complementary to andcapable of mating with connector 1040 of FIG. 10A in accordance with anembodiment of the present invention. Connector 6300 is substantiallysimilar to connector 6200 in FIGS. 62A and 62B. For example, magneticcomponents 6382, 6383 and 6384 of FIG. 63A are similar, respectively, tomagnetic component 6282, 6283, and 6284 of FIG. 62A.

Connector 6300 can include four contact tips 6390, 6392, 6394 and 6396that can be biased to extend from housing 6310. Each contact tip canhave a width 6303 of approximately 0.5 millimeters. Width 6303 may beadvantageously sized to be large enough to easily connect withconnectors on headsets (e.g., connector 16 of FIG. 1) while not being solarge that contact tips 6390, 6392, 6394, and 6396 are stiff and cannotbe depressed by a headset coupling with connector 6300.

The centerline of each contact tip can be separated from the centerlineof an adjacent contact tip by pitch 6302. Pitch 6302 can be chosen sothat the contacts of connector 6300 are capable of electrically couplingwith the contacts of a headset connector (e.g., connector 1040 of FIG.10A). Accordingly, pitch 6302 can be approximately 1.97 millimeters sothat it corresponds to pitch 5583 shown in FIG. 55A. Moreover, pitch6302 can be selected from a range between 1.75 and 2.25 millimeters. Thesize of pitch 6302 may also be advantageous for placing magneticcomponents (e.g., components 6382, 6383, and 6384) in between thecontacts of connector 6300. The centerline of outer contact tips 6390and 6396 can be separated by width 6301, which can be approximately 5.1millimeters or from a range between 4.7 millimeters and 5.4 millimeters.Width 6301 can be selected such that contact tips 6390 and 6396 cancouple with the outer contacts of a headset (see e.g., contacts 5561 and5564 of FIG. 55A). In some embodiments, the outer contacts of a headsetmay be configured to receive power, and a connector, similar toconnector 6300 but not including contact tips 6392 and 6394, can beprovided to transmit only power to the headset. Such a connector may beeasier to manufacture and cheaper than connector 6200.

Connector 6300 can have a raised face 6312 that is capable of couplingwith a headset connector (e.g., connector 1040 of FIG. 10A). The housing6310 of connector 6300 can have a total height 6304, which can beapproximately 5.1 millimeters or from a range between 4.9 millimetersand 5.3 millimeters. The total height 6304 of a connector may beadvantageously selected to correspond with the total height of aheadset's primary housing (see e.g., height 5580 of FIG. 55B) such thatconnector 6300 can receive a headset's primary housing. The raised face6312 of housing 6310 can have a height 6305, which can be approximately3.43 millimeters or from a range between 3.2 and 3.7 millimeters. Height6305 can be selected such that it is less than the height of an internalcavity inside of a headset's primary housing (see e.g., height 5581)such that connector 6300 can easily couple with a headset. In summary,heights 6304 and 6305 can be selected in order to complement heights5580 and 5581 of FIG. 55B, thereby allowing headset 5500 to mate withconnector 6300. It is understood that the mating face of connector 6300is angled with respect to the rest of the connector. This angle can, forexample, range from ten to thirty degrees. Heights 6304 and 6305reference the orthogonal heights of the corresponding elements. This issimilar to the radial dimensions that are shown in FIG. 55B.

In order to apply pressure to the contacts of a complementary connector,the contact tips 6390, 6392, 6394 and 6396 can be biased to extend fromconnector housing 6310. When no complementary connector is present,contact tips 6390, 6392, 6394 and 6396 can extend from the housing bydistance 6306 of approximately 0.7 millimeters. Distance 6306 can beselected such that the contact tips can advantageously apply enoughpressure to a headphone's contacts such that the tips can reliablycouple with the headphone's contacts.

Connector 6300 can also include contacts or wires (not shown) that allowthe connector to route electrical signals from contact tips 6390, 6392,6394 and 6396 to other circuitry. The dimensions given above apply tothe embodiments shown in 63A and 63B and it is understood that otherdimensions can be used without deviating from the scope of the presentinvention.

FIG. 64 shows a view of headset 6498 coupled with connector 6499 inaccordance with an embodiment of the present invention. Headset 6498 canbe substantially similar to headset 1000 of FIGS. 10A and 10B and caninclude the features shown on connector 1040. Connector 6499 can beinstalled in, for example, docking station 6400 which can include asocket in which a headset can be inserted. Docking stationssubstantially similar to or the same as docking station 6400 arediscussed in U.S. patent application Ser. No. 11/620,669 entitled“Apparatuses and Methods that Facilitate the Transfer of Power andInformation Among Electrical Devices” which is incorporated herein. Thesocket in docking station 6400 can be shaped to align headset 6498properly with respect to connector 6499. Connector 6499 can includeraised face 6412 and lower perimeter 6414 to further align headset 6498.Raised face 6412 can extend into the cavity created by a recessedheadset connector while the headset's primary housing abuts perimeter6414.

This alignment can result in the contacts of headset 6498 (see e.g.,contacts 1042 of FIG. 10A) being approximately centered over the tip ofcontact 6490. Contact 6490 can be biased to extend beyond raised face6412 by coil 6491. This bias can be represented by a force exerted inthe direction of arrow 6401. Additionally, arrow 6402 can represent themagnetic force generated by the proximity of the connector plate ofheadset 6498 (see e.g., connector plate 1041 of FIG. 10A) to the arrayof magnetic components of connector 6499 (see e.g., array 6180 of FIG.61). This magnetic force can cause contact 6490 to electrically couplewith a contact on headset 6498. Connector 6499 can include additionalcontacts (see e.g., contacts 6290, 6292, 6294 and 6296) which can couplewith the remaining contacts of headset 6498. Connector 6499 can bemounted on circuit board 6480 in docking station 6400 such that circuitboard 6480 can route signals to and from headset 6498 when it is coupledwith connector 6499.

FIG. 65 shows graph 6500 which depicts the approximate change of the twoforces described above as the separation between the magnetic componentsand the connector plate varies in accordance with an embodiment of thepresent invention. In graph 6500, x-axis 6502 can represent theapproximate force, and y-axis 6504 can represent the distance betweenthe magnetic components and the connector plate. The separation wherethe x-axis intercepts the y-axis is zero, and this point can representwhen the connector plate is in contact with the magnetic components. Asthe separation increases, approximate force 6508 from spring contactspushing on a connector plate in a headset can decrease linearly becauseof the substantially linear nature of coil springs. While the springforce decreases linearly, the approximate magnetic force 6506 candecrease exponentially due to the behavior of magnetic materials.

It can be desirable to choose magnetic components (e.g., magnets,connector plates) and design spring components (e.g., contact coils)such that the magnetic force biasing a headset's connector plate to acomplementary connector is greater than the force of the spring contactspushing back on the connector plate at all possible distances ofseparation between the two parts. If there are situations where thespring force is greater than the magnetic force, it might be necessaryto apply an external force in order to properly couple a headset with acomplementary connector. Applying this external force might requireintervention from a user, and therefore, it can be desirable to design aconnection system so that the magnetic force is always greater that thespring force.

FIG. 66 shows charging device 6600 that can be used in conjunction witha headset in accordance with an embodiment of the present invention. Insome embodiments, connector 6601 can be integrated into device 6600,thereby allowing device 6600 to be electrically coupled with a headset.Connector 6601 is similar to the connectors discussed in connection withFIGS. 61-65.

In some embodiments, auxiliary connector 6610 can be integrated intocharging device 6600. As such, auxiliary connector 6610 can be used tocouple an additional device, such as a cellular phone which can be usedwith a headset, to device 6600. In order to connect a headset oradditional device to an external power supply (e.g., wall outlet orcomputer), device 6600 can include cable 6620. Circuitry 6630 can beintegrated into device 6600 to facilitate charging of both a headset andan additional device. Circuitry 6630 can also provide a communicationsinterface for data to be shared between a headset and an additionaldevice. An example of a charging device similar to device 6600 isdiscussed in detail within U.S. patent application Ser. No. 11/620,669entitled “Apparatuses and Methods that Facilitate the Transfer of Powerand Information Among Electrical Devices,” which is incorporated herein.

FIGS. 67A and 67B show connector 6710 in accordance with an embodimentof the present invention. The face of connector 6710 can be shaped toinclude peak 6711. By incorporating peak 6711 into the connector face,connector 6710 is capable of mating with a headset in two differentinterface orientations (e.g., physical orientations). When connector6710 is installed in docking station 6700 (see FIG. 67B), peak 6711creates cavities 6702 and 6704 which can each accept the long side 6721of headset 6720. In the interface orientation shown in FIG. 67B, side6721 of headset 6720 is in cavity 6704. However, if headset 6720 wereinserted in another orientation, long side 6721 of the headset may be incavity 6702. In either of these orientations, the contacts of connector6710 can be electrically coupled with the contacts on headset 6720.

In some embodiments, switching circuitry can be included in headset 6720to compensate for these different interface orientations. Such switchingcircuitry can determine the interface orientation of headset 6720 andconnector 6710 and route signals received from the connector to pathwaysinside the headset (e.g., electrical traces) based on the determinedorientation. In other embodiments, switching circuitry can be providedin docking station 6700 that can determine the interface orientation ofconnector 6710 and headset 6720 and route signals to the connector basedon the determined orientation. A detailed discussion of similarswitching circuitry can be found in U.S. patent application Ser. No.11/650,130 entitled “Systems and Methods for Determining theConfiguration of Electronic Connections,” which is incorporated herein.

Similar to the elevated face 6212 and recessed perimeter 6214 shown inFIG. 62B, raised face 6712 and recessed perimeter 6714 can beadvantageous when coupling a headset (see e.g., headset 1000 of FIGS.10A and 10B) to connector 6710. For example, raised face 6712 andrecessed perimeter 6714 can provide structural features that strengthenthe mechanical coupling of connector 6710 and a headset.

FIG. 68 shows chart 6800 listing exemplary modes and functions of acommunications system in accordance with an embodiment of the presentinvention. With regards to chart 6800, a communications system caninclude a headset (e.g., headset 10 of FIG. 1) and a host device (e.g.,a cellular telephone, a laptop computer, etc.). Further defining thecommunications system referenced in chart 6800, the headset can be incommunication with the host device and the host device can becommunicating with other devices through a cellular network or othercommunications network (e.g., Voice over Internet Protocol).

Chart 6800 includes rows describing exemplary modes and functions of thesystem and columns identifying inputs and outputs that correspond toeach mode or function. Some of the functions listed in column 6810typically occur when a system is in a certain mode, and therefore, thesefunctions can be listed under their respective modes. For example, theanswer call function 6812 and the reject call function 6813 aretypically executed when a system is in incoming call mode 6811 and chart6800 can reflect this by listing functions 6812 and 6813 directly underincoming call mode 6811.

For each row corresponding to a function, column 6820 can be used toidentify an input that can cause that function to occur. For example,column 6820 may identify a manner in which a user can press a singlebutton on a headset (see e.g., button 14 of FIG. 1) to initiate acorresponding function. It is understood that the initiated function mayfurther depend on the mode in which a headset is in. For example, a longbutton press may initiate the reject call function 6813 if a system isin incoming call mode 6811, while the same type of button press mayinitiate function 6814 if the system is in another mode. Examples ofusing a single button to control an electronic device can be found inU.S. Provisional Patent Application No. 60/936,965 entitled “Single UserInput Mechanism for Controlling Electronic Device Operations,” which isincorporated herein.

Outputs can be associated with each mode or function so that, forexample, a user can be aware of a system's operation. Such outputs maybe provided through a headset display system (see e.g., display system18 of FIG. 1), a headset audio system (e.g., speaker system 13 of FIG.1), and/or host device user interface (UI). A display screen and aspeaker on a host device can, for example, be part of a host device UIused to provide outputs. Column 6830 lists outputs that can be providedby a headset display system to correspond with modes or functions listedin column 6810. For example, if a headset's display system includes anindicator that can output different colors using LEDs, column 6830 caninclude different colors and/or flashing patterns that the indicator canoutput based on the communication systems mode or function. Column 6840lists outputs that can be provided by a headset audio system (e.g., aspeaker) based on the communication system's mode or function. Column6840 can, for example, include beeps, tones, or other noises that can beused to notify the operation of the communications system. Column 6850lists outputs that can be provided by a Host Device UI. For example,column 6850, may include outputs that can be presented through a displayscreen on a host device.

In summary, chart 6800 identifies the inputs and outputs correspondingto various exemplary modes and functions of a communications system inaccordance with an embodiment of the present invention. For example,when a communications system is in incoming call mode 6811, the system'sheadset (e.g., headset 10 of FIG. 1) can display a slow blinking greenlight and output two beeps while the system's host device can display anincoming call screen (e.g., a graphic displaying information about theincoming call). Continuing the example, if a user presses a button onthe headset (e.g., button 14 of FIG. 1) for a short amount of time, thesystem can answer the call while the headset displays a green light andoutputs a short low tone followed by a short high tone. While the systemis answering the call, the host device can display a call answer screen.It is understood that the modes and functions shown in FIG. 68 anddiscussed above are merely exemplary and that communication systems canoperate using other modes and functions without deviating from thespirit and scope of the present invention.

Although particular embodiments of the present invention have beendescribed above in detail, it will be understood that this descriptionis merely for purposes of illustration. Alternative embodiments of thosedescribed herein are also within the scope of the present invention. Forexample, while one embodiment can include a Bluetooth headset, one ormore features of the present invention also can be incorporated intoheadsets employing other wired and/or wireless communication protocols.Also, while some embodiments of the present invention can includeheadsets configured for communication with a cellular phone and/orpersonal media device (e.g., a portable media player similar to thatsold under the trademark iPod® by Apple Inc. of Cupertino, Calif.), oneor more features of the present invention can also be incorporated intoheadsets configured for communication with any electronic device.Furthermore, while one embodiment illustratively described above caninclude a headset and methods for fabricating the same, one or morefeatures of the present invention can also be incorporated into otherelectronic devices that require, e.g., circuit boards distributed withinsmall acoustic volumes, symmetric connectors, extruded housings havingone or more internal features, microperforations, co-located microphonesand connectors, magnetic connectors, or any combination thereof.

Various configurations described herein may be combined withoutdeparting from the present invention. The above described embodiments ofthe present invention are presented for purposes of illustration and notof limitation. The present invention also can take many forms other thanthose explicitly described herein. Accordingly, it is emphasized thatthe invention is not limited to the explicitly disclosed methods,systems and apparatuses, but is intended to include variations to andmodifications thereof which are within the spirit of the followingclaims.

What is claimed is:
 1. A wireless headset device comprising: an earbudassembly for insertion into an ear, the earbud assembly comprising anearbud flexible circuit board having mounted thereon a receiver andsignal processing circuitry positioned within the earbud assembly,wherein: the signal processing circuitry comprises a processor; and theearbud flexible circuit board folds over at least one of the receiverand the signal processing circuitry within the earbud assembly; and aprimary housing assembly being a longitudinal member coupled via a neckportion to the earbud assembly which protrudes away from one end of theprimary housing assembly, the primary housing assembly configured to bepositioned outside of the ear when the earbud assembly is insertedwithin the ear, the primary housing assembly comprising: a microphone atan opposite end distal from the earbud assembly; a battery; and aprimary housing flexible circuit board electrically coupled to theearbud flexible circuit board, the microphone, and the battery.
 2. Thedevice of claim 1, wherein the neck portion fixes the earbud assembly tothe primary housing assembly.
 3. The device of claim 2, the neck portioncomprising a through-hole through which a portion of the earbud flexiblecircuit board passes through to electrically connect to the primaryhousing circuit board.
 4. The device of claim 1, wherein the earbudflexible circuit board comprises traces for electrically coupling atleast the receiver and the signal processing circuitry.
 5. The device ofclaim 1, wherein the signal processing circuitry is operative to executewireless communication processes.
 6. The device of claim 1, wherein thesignal processing circuitry is operative to process Bluetoothcommunication processes.
 7. The device of claim 1, wherein the primaryhousing assembly further comprises: an antenna electrically coupled tothe primary housing flexible circuit board.
 8. The device of claim 1,wherein the primary housing assembly further comprises: a switchelectrically coupled to the primary housing flexible circuit board. 9.The device of claim 1, wherein the primary housing assembly furthercomprises: a connector assembly electrically coupled to the primaryhousing flexible circuit board, the connector assembly operative tointerface with a device other than the wireless headset device.
 10. Thedevice of claim 9, wherein the connector assembly comprises: amultiple-pin symmetrical magnetic connector.
 11. The device of claim 1,further comprising: a thermistor in communication with and operative toprovide the signal processing circuitry with a battery temperaturesignal.
 12. The device of claim 11, wherein the signal processingcircuitry is operative to adjust a battery charging rate based on thebattery temperature signal.
 13. The device of claim 1, wherein theprimary housing flexible circuit board comprises circuitry mountedthereon.
 14. The device of claim 13, wherein the circuitry mounted onthe primary housing flexible circuit board comprises switchingcircuitry.
 15. The device of claim 13, wherein the circuitry mounted onthe primary housing flexible circuit board comprises adaptive batterycharging circuitry.
 16. The device of claim 1, wherein at least aportion of the receiver overlaps with at least a portion of the signalprocessing circuitry in a direction of output of sound from the earbudassembly.
 17. The device of claim 1, wherein the receiver and the signalprocessing circuitry are stacked due to the folding of the earbudflexible circuit board.
 18. A wireless headset device comprising: anearbud assembly comprising an earbud flexible circuit board; and aprimary housing assembly coupled via a neck portion to the earbudassembly, the primary housing assembly configured to be positionedoutside of a wearer's ear when the earbud assembly is inserted withinthe wearer's ear, the primary housing assembly comprising: a battery; amicrophone; and a primary housing flexible circuit board electricallycoupled to the earbud flexible circuit board, the battery, and themicrophone, the primary housing flexible circuit board being bent so asto be disposed adjacent to multiple sides of the battery to conservespace.
 19. The device of claim 18, wherein the earbud flexible circuitboard is electrically coupled to the primary housing flexible circuitboard.
 20. The device of claim 18, wherein the primary housing flexiblecircuit board is bent such that it covers at least a portion of thebattery.
 21. A wireless headset device comprising: an earbud assemblyfor insertion into an ear, the earbud assembly comprising an earbudflexible circuit board having mounted thereon components comprising areceiver and signal processing circuitry, wherein the signal processingcircuitry comprises a processor, and wherein the earbud flexible circuitboard folds over at least one of the components within the earbudassembly; and a primary housing assembly being a longitudinal membercoupled via a neck portion to the earbud assembly which protrudes awayfrom one end of the primary housing assembly, the primary housingassembly configured to be positioned outside of the ear when the earbudassembly is inserted within the ear, the primary housing assemblycomprising: a microphone at an opposite end distal from the earbudassembly; a battery; at least one of an antenna at the one end proximalthe earbud assembly and a user interface button at the one end proximalthe earbud assembly; and a primary housing flexible circuit boardelectrically coupled to the earbud flexible circuit board, themicrophone, the battery, and at least one of the antenna and the userinterface button, wherein the primary housing flexible circuit board isbent so as to be disposed adjacent to multiple sides of the battery toconserve space.
 22. The device of claim 21, wherein the neck portionfixes the earbud assembly to the primary housing assembly.
 23. Thedevice of claim 21, wherein the earbud flexible circuit board comprisestraces for electrically coupling at least the receiver and the signalprocessing circuitry.
 24. The device of claim 21, wherein the primaryhousing flexible circuit board comprises circuitry mounted thereon. 25.The device of claim 21, wherein the circuitry mounted on the primaryhousing flexible circuit board comprises switching circuitry.